ZHCS792F March   2012  – January 2017 TLV62090

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Softstart (SS) and Hiccup Current Limit During Startup
      3. 7.3.3 Voltage Tracking (SS)
      4. 7.3.4 Short Circuit Protection (Hiccup-Mode)
      5. 7.3.5 Output Discharge Function
      6. 7.3.6 Power Good Output (PG)
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Thermal Shutdown
      9. 7.3.9 Charge Pump (CP, CN)
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 Power Save Mode Operation
      3. 7.4.3 Low Dropout Operation (100% Duty Cycle)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH® Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Input and Output Capacitor Selection
        4. 8.2.2.4 Setting the Output Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guideline
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 使用 WEBENCH® 工具定制设计方案
    2. 11.2 文档支持
      1. 11.2.1 Third-Party Products Disclaimer
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGT|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

RGT Package
16-Pin VQFN
Top View
TLV62090 po_lvsbb9.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
SW 1, 2 I/O Switch pin of the power stage.
DEF 3 I This pin is used for internal logic and needs to be pulled high. This pin should not be left floating.
PG 4 O Power good open drain output. This pin is high impedance if the output voltage is within regulation. This pin is pulled low if the output is below its nominal value. The pull up resistor can not be connected to any voltage higher than the input voltage of the device.
FB 5 I Feedback pin of the device. Connect a resistor divider to set the output voltage.
AGND 6 Analog ground.
CP 7 I/O Internal charge pump flying capacitor. Connect a 10 nF capacitor between CP and CN.
CN 8 I/O Internal charge pump flying capacitor. Connect a 10 nF capacitor between CP and CN.
SS 9 I Softstart control pin. A capacitor is connected to this pin and sets the softstart time. Leaving this pin floating sets the minimum start-up time.
AVIN 10 I Bias supply input voltage pin.
PVIN 11,12 I Power supply input voltage pin.
EN 13 I Device enable. To enable the device this pin needs to be pulled high. Pulling this pin low disables the device. This pin has a pull down resistor of typically 400 kΩ, which is active when EN is low.
PGND 14,15 Power ground connection.
VOS 16 I Output voltage sense pin. This pin needs to be connected to the output voltage.
Exposed Thermal Pad The exposed thermal pad is connected to AGND. It must be soldered for mechanical reliability.