SLDS165A December   2008  – December 2014 TLC5941-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Pin Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Parameter Equations
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Interface
      2. 8.3.2 Error Information Output
      3. 8.3.3 TEF: Thermal Error Flag
      4. 8.3.4 LOD: LED Open Detection
      5. 8.3.5 Delay Between Outputs
      6. 8.3.6 Output Enable
      7. 8.3.7 Status Information Output
      8. 8.3.8 Grayscale PWM Operation
        1. 8.3.8.1 Output On Time
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting Maximum Channel Current
        2. 9.2.2.2 Power Dissipation Calculation
        3. 9.2.2.3 Setting Dot Correction
        4. 9.2.2.4 Setting Grayscale
        5. 9.2.2.5 Serial Data Transfer Rate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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11 Layout

11.1 Layout Guidelines

In order to prevent thermal shutdown, TJ must be less than 150ºC. If the input voltage is very high, the power dissipation might be large. Currently there is the HTSSOP package which has good thermal impedance, but at the same time, the PCB layout is also very important. Good PCB design can optimize heat transfer, which is absolutely essential for the long-term reliability of the device.

  • Maximize the copper coverage on the PCB to increase the thermal conductivity of the board, because the major heat-flow path from the package to the ambient is through the copper on the PCB. Maximum copper is extremely important when there are not any heat sinks attached to the PCB on the other side of the package.
  • Add as many thermal vias as possible directly under the package ground pad to optimize the thermal conductivity of the board.
  • All thermal vias should be either plated shut or plugged and capped on both sides of the board to prevent solder voids. To ensure reliability and performance, the solder coverage should be at least 85 percent.

11.2 Layout Example

layout_slds165.gifFigure 25. PCB Layout Example