ZHCSEQ9A March   2016  – March  2016 TLC59116-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection
      2. 9.3.2 Overtemperature Detection and Shutdown
      3. 9.3.3 Power-On Reset (POR)
      4. 9.3.4 External Reset
      5. 9.3.5 Software Reset
      6. 9.3.6 Individual Brightness Control With Group Dimming/Blinking
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active
      2. 9.4.2 Standby
    5. 9.5 Programming
      1. 9.5.1 Characteristics of the I2C Bus
        1. 9.5.1.1 Bit Transfer
        2. 9.5.1.2 Start and Stop Conditions
        3. 9.5.1.3 Acknowledge
      2. 9.5.2 System Configuration
      3. 9.5.3 Device Address
      4. 9.5.4 Regular I2C Bus Slave Address
      5. 9.5.5 LED All Call I2C Bus Address
      6. 9.5.6 LED Sub Call I2C Bus Address
      7. 9.5.7 Software Reset I2C Bus Address
      8. 9.5.8 Control Register
    6. 9.6 Register Maps
      1. 9.6.1  Mode Register 1 (MODE1)
      2. 9.6.2  Mode Register 2 (MODE2)
      3. 9.6.3  Brightness Control Registers 0 to 15 (PWM0 to PWM15)
      4. 9.6.4  Group Duty Cycle Control Register (GRPPWM)
      5. 9.6.5  Group Frequency Register (GRPFREQ)
      6. 9.6.6  LED Driver Output State Registers 0 to 3 (LEDOUT0 to LEDOUT3)
      7. 9.6.7  I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
      8. 9.6.8  LED All Call I2C Bus Address Register (ALLCALLADR)
      9. 9.6.9  Output Gain Control Register (IREF)
      10. 9.6.10 Error Flags Registers (EFLAG1, EFLAG2)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Constant Current Output
      2. 10.1.2 Adjusting Output Current
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档　
    2. 13.2 社区资源
    3. 13.3 商标
    4. 13.4 静电放电警告
    5. 13.5 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 文档支持

13.1.1 相关文档　

相关文档如下：

  • 《TLC59116EVM-390 用户指南》，SLVU296
  • TLC59116FEVM-571，SLVU367

13.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.