ZHCSD78 January   2015 TLC2274-HT

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, VDD = 5 V
    6. 6.6 Operating Characteristics, VDD = 5 V
    7. 6.7 Electrical Characteristics, VDD± = ±5 V
    8. 6.8 Operating Characteristics, VDD± = ±5 V
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Macromodel Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Layout

10.1 Layout Guidelines

The TLC2274 has very-low offset voltage and drift. To achieve highest performance, optimize circuit layout and mechanical conditions. Offset voltage and drift can be degraded by small thermoelectric potentials at the operational amplifier inputs. Connections of dissimilar metals generate thermal potential, which can degrade the ultimate performance of the TLC2274. Cancel these thermal potentials by assuring that they are equal in both input terminals.

  • Keep the thermal mass of the connections made to the two input terminals similar.
  • Locate heat sources as far as possible from the critical input circuitry.
  • Shield operational amplifier and input circuitry from air currents such as cooling fans.

10.2 Layout Example

layout_ex_BOS714.gifFigure 52. Board Layout Example