ZHCSFV9A May   2016  – December 2016 TAS5722L

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable I2C Address
      2. 7.3.2 I2C Interface
        1. 7.3.2.1 Writing to the I2C Interface
        2. 7.3.2.2 Reading from the I2C Interface
      3. 7.3.3 Serial Audio Interface (SAIF)
        1. 7.3.3.1 Stereo I2S Format Timing
        2. 7.3.3.2 Stereo Left-Justified Format Timing
        3. 7.3.3.3 Stereo Right-Justified Format Timing
        4. 7.3.3.4 TDM Format Timing
      4. 7.3.4 Audio Signal Path
        1. 7.3.4.1 High-Pass Filter (HPF)
        2. 7.3.4.2 Amplifier Analog Gain and Digital Volume Control
        3. 7.3.4.3 Digital Clipper
        4. 7.3.4.4 Class-D Amplifier Settings
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SDZ)
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Mode Timing
      4. 7.4.4 Auto Sleep Mode
      5. 7.4.5 Active Mode
      6. 7.4.6 Mute Mode
      7. 7.4.7 Faults and Status
    5. 7.5 Register Maps
      1. 7.5.1 I2C Register Map Summary
      2. 7.5.2 Register Maps
        1. 7.5.2.1  Device Identification Register (0x00)
        2. 7.5.2.2  Power Control Register (0x01)
        3. 7.5.2.3  Digital Control Register 1 (0x02)
        4. 7.5.2.4  Register Name (offset = ) [reset = ] or (address = ) [reset = ]
        5. 7.5.2.5  Volume Control Register (0x04)
        6. 7.5.2.6  Analog Control Register (0x06)
        7. 7.5.2.7  Fault Configuration and Error Status Register (0x08)
        8. 7.5.2.8  Digital Clipper 2 Register (0x10)
        9. 7.5.2.9  Digital Clipper 1 Register (0x11)
        10. 7.5.2.10 Digital Control Register 3 (0x13)
        11. 7.5.2.11 Analog Control Register 2 (0x14)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Design Procedure
        1. 8.2.2.1 Overview
        2. 8.2.2.2 Select the PWM Frequency
        3. 8.2.2.3 Select the Amplifier Gain and Digital Volume Control
        4. 8.2.2.4 Select Input Capacitance
        5. 8.2.2.5 Select Decoupling Capacitors
        6. 8.2.2.6 Select Bootstrap Capacitors
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 Glossary
  12. 12机械封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 机械封装和可订购信息

以下页中包括机械封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。

12.1 Package Option Addendum

12.1.1 Packaging Information

Orderable Device Status (1) Package Type Package
Drawing		 Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
TAS5722LRSMR ACTIVE VQFN RSM 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR –25 to 85 TAS
5722L
TAS5722LRSMT ACTIVE VQFN RSM 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR –25 to 85 TAS
5722L
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

12.1.2 Tape and Reel Information

TAS5722L Tape_and_Reel_Dims.gif
Device Package
Type		 Package Drawing Pins SPQ Reel
Diameter (mm)		 Reel
Width W1 (mm)		 A0
(mm)		 B0
(mm)		 K0
(mm)		 P1
(mm)		 W
(mm)		 Pin1
Quadrant
TAS5722LRSMR VQFN RSM 32 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TAS5722LRSMT VQFN RSM 32 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TAS5722LRSMR VQFN RSM 32 3000 367.0 367.0 35.0
TAS5722LRSMT VQFN RSM 32 250 210.0 185.0 35.0