ZHCS929A May   2012  – March 2015 TAS5622A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Audio Specification Stereo (BTL)
    7. 6.7 Audio Specification 4 Channels (SE)
    8. 6.8 Audio Specification Mono (PBTL)
    9. 6.9 Typical Characteristics
      1. 6.9.1 Typical Characteristics, BTL Configuration
      2. 6.9.2 Typical Characteristics, SE Configuration
      3. 6.9.3 Typical Characteristics, PBTL Configuration
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  System Power-Up and Power-Down Sequence
        1. 7.3.1.1 Powering Up
        2. 7.3.1.2 Powering Down
      2. 7.3.2  Start-up and Shutdown Ramp Sequence
      3. 7.3.3  Unused Output Channels
      4. 7.3.4  Device Protection System
      5. 7.3.5  Pin-to-Pin Short Circuit Protection (PPSC)
      6. 7.3.6  Overtemperature Protection
      7. 7.3.7  Overtemperature Warning, OTW
      8. 7.3.8  Undervoltage Protection (UVP) and Power-On Reset (POR)
      9. 7.3.9  Error Reporting
      10. 7.3.10 Fault Handling
      11. 7.3.11 Device Reset
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical BTL Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical SE Configuration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Typical PBTL Configuration
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Boot Strap Supply
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material Recommendation
      2. 10.1.2 PVDD Capacitor Recommendation
      3. 10.1.3 Decoupling Capacitor Recommendation
      4. 10.1.4 Circuit Component Requirements
      5. 10.1.5 Printed Circuit Board Requirements
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 机械封装和可订购信息

以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。