ZHCSCN7C March   2014  – January 2015 TAS5421-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Audio Input and Preamplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Gate Drive
      4. 7.3.4 Power FETs
      5. 7.3.5 Load Diagnostics
      6. 7.3.6 Protection and Monitoring
      7. 7.3.7 I2C Serial Communication Bus
        1. 7.3.7.1 I2C Bus Protocol
        2. 7.3.7.2 Random Write
        3. 7.3.7.3 Random Read
        4. 7.3.7.4 Sequential Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Hardware Control Pins
      2. 7.4.2 EMI Considerations
      3. 7.4.3 Operating Modes and Faults
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Amplifier Output Filtering
        2. 8.2.1.2 Amplifier Output Snubbers
        3. 8.2.1.3 Bootstrap Capacitors
        4. 8.2.1.4 Analog Audio Input Filter
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Unused Pin Connections
        1. 8.2.4.1 MUTE Pin
        2. 8.2.4.2 STANDBY Pin
        3. 8.2.4.3 I2C Pins (SDA and SCL)
        4. 8.2.4.4 Terminating Unused Outputs
        5. 8.2.4.5 Using a Single-Ended Audio Input
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Top Layer
      2. 10.2.2 Second Layer - Signal Layer
      3. 10.2.3 Third Layer - Power Layer
      4. 10.2.4 Bottom Layer - Ground Layer
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (July 2014) to C Revision

  • Moved Tstg from Handling Ratings table to Absolute Maximum Ratings table Go
  • Changed Handling Ratings table to ESD Ratings Go
  • In "1. Load Diagnostics" paragraph, changed "at start-up" to "on de-assertion of STANDBY" and appended two new sentences Go
  • Changed Section number of I2C Serial Communication Bus from 7.4 to 7.3.7 Go
  • Changed Table 3Go
  • Added disclaimer to beginning of Application and Implementation sectionGo
  • Added Power Supply Recommendations section and moved the contents of former Section 8.2.1.5 hereGo
  • Created a Layout Examples section to contain former sections 9.1.1 through 9.1.4Go
  • Placed text ahead of graphics for Figure 18 through Figure 21Go
  • 添加了第三方组件免责声明Go

Changes from A Revision (July 2014) to B Revision

  • 数据表状态从产品预览更改为生产数据Go

Changes from * Revision (March 2014) to A Revision

  • Added content to the preliminary data sheet to create the full PRODUCT PREVIEW data sheet Go