SLLS977F April   2009  – July 2017 SN75DP139

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (Device Power)
    6. 6.6  Electrical Characteristics (Hot Plug Detect)
    7. 6.7  Electrical Characteristics (Aux / I2C Pins)
    8. 6.8  Electrical Characteristics (TMDS and Main Link Pins)
    9. 6.9  Switching Characteristics (Hot Plug Detect)
    10. 6.10 Switching Characteristics (Aux / I2C Pins)
    11. 6.11 Switching Characteristics (TMDS and Main Link Pins)
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hot Plug Detect
      2. 7.3.2 Aux / I2C Pins
      3. 7.3.3 TMDS and Main Link Pins
      4. 7.3.4 Input/Output Equivalent Circuits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active
      2. 7.4.2 Low Power With DDC Channel Enabled
      3. 7.4.3 Low Power
    5. 7.5 Programming
      1. 7.5.1 I2C Interface Notes
      2. 7.5.2 General I2C Protocol
      3. 7.5.3 Slave Address
        1. 7.5.3.1 Sink Port Selection Register And Source Plug-In Status Register Description (Sub-Address)
        2. 7.5.3.2 Example - Reading From The SN75DP139:
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 DVI Application
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layer Stack
      2. 10.1.2 Differential Traces
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.