ZHCSJI5N April   1999  – March 2019 SN74LVC2G157

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     逻辑图（正逻辑）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Standard CMOS Inputs
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Negative Clamping Diodes
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power
        2. 9.2.1.2 Inputs
        3. 9.2.1.3 Outputs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • YZP|8
  • DCT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from M Revision (June 2015) to N Revision

  • Changed YZP package pinout drawing to match mechanical data drawing; and, pin functions description for clarity Go
  • Added additional thermal metrics for all packages.Go
  • Added detailed feature description sections for Standard CMOS Inputs, Balanced High-Drive CMOS Push-Pull Outputs, and Negative Clamping Diodes.Go
  • Added improved Design Requirements and Detailed Design Procedure.Go
  • Changed verbiage to better reflect recommendations for this specific device rather than logic devices in general.Go
  • Added layout example for the YZP package.Go

Changes from L Revision (January 2014) to M Revision

  • Added ESD Ratings table.Go
  • Added Thermal Information table.Go
  • Added Typical CharacteristicsGo
  • Added 机械、封装和可订购信息 部分。Go

Changes from K Revision (January 2007) to L Revision

  • 将文档更新为新的 TI 数据表格式。Go
  • 删除了订购信息 表Go
  • 已更新特性Go
  • Added 器件信息 表Go