ZHCSKI5D November   2019  – December 2021 SN74HCS74

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (January 2021) to Revision D (December 2021)

  • 向“器件信息”添加了 DYY 封装信息Go
  • Added DYY package information to Pin Configuration and Functions Go
  •  Added DYY package to Thermal Information tableGo

Changes from Revision B (November 2020) to Revision C (January 2021)

  • 将 BQA 封装状态从“预发布”更改为“正在供货”Go
  • 将数据表状态从“混合状态”更改为“量产数据”Go

Changes from Revision A (May 2020) to Revision B (November 2020)

  • 更新了整个文档中的表格、图和交叉参考的编号格式。Go
  • 向“器件信息”添加了 BQA 封装信息Go
  • Added BQA pinout diagram and package information to Pin Configuration and Functions Go
  • Added BQA package to Thermal Information tableGo

Changes from Revision * (November 2019) to Revision A (May 2020)

  • 向“器件信息”添加了 D 封装信息Go
  • Added D package information to Pin Configuration and Functions Go
  • Added D package column to Thermal Information tableGo