SCES387L march   2002  – June 2017 SN74AUC1G79

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics: CL = 15 pF
    8. 6.8 Switching Characteristics: CL = 30 pF
    9. 6.9 Operating Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Community Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DCK|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from K Revision (April 2007) to L Revision

  • Deleted DRY package throughout data sheetGo
  • Added Applications, Device Information table, Pin Configuration and Functions, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information at the end of the data sheet Go
  • Changed pin names in the pinout diagram for the YZP package, from: "A" to:"D," from:"B" to:"CLK," and from:"Y" to: "Q"Go