ZHCSUM3C
March 2007 – February 2024
SN65C1167E
,
SN65C1168E
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Driver Output and Receiver Input ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Driver Section Electrical Characteristics
5.6
Receiver Section Electrical Characteristics
5.7
Driver Section Switching Characteristics
5.8
Receiver Section Switching Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Active High Driver Output Enables
7.3.2
Active Low Receiver Enables
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.3
Power Supply Recommendations
9
Device and Documentation Support
9.1
Device Support
9.2
Receiving Notification of Documentation Updates
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PW|16
MPDS361A
RGY|16
MPQF115G
NS|16
MPDS551A
散热焊盘机械数据 (封装 | 引脚)
RGY|16
QFND040P
订购信息
zhcsum3c_oa
zhcsum3c_pm
9.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。