ZHCSNA8H December   1982  – August 2021 SN54HC00 , SN74HC00

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Commercial (74xx)
    6. 6.6 Electrical Characteristics - Military (54xx)
    7. 6.7 Switching Characteristics - Commercial (74xx)
    8. 6.8 Switching Characteristics - Military (54xx)
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Balanced CMOS Push-Pull Outputs
    4. 8.4 Standard CMOS Inputs
    5. 8.5 Clamp Diode Structure
    6. 8.6 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

6.4 Thermal Information

THERMAL METRIC(1) SN74HC00 UNIT
D (SOIC) DB (SSOP) N (PDIP) NS (SOP) PW (TSSOP)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 133.6 108.3 57.5 91.0 151.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 89.0 60.3 45.1 48.8 79.4 °C/W
RθJB Junction-to-board thermal resistance 89.5 55.7 37.3 49.8 94.7 °C/W
ΨJT Junction-to-top characterization parameter 45.5 25 30.3 18.4 25.2 °C/W
ΨJB Junction-to-board characterization parameter 89.1 55.2 37.2 49.5 94.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.