ZHCSNA8H December   1982  – August 2021 SN54HC00 , SN74HC00

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Commercial (74xx)
    6. 6.6 Electrical Characteristics - Military (54xx)
    7. 6.7 Switching Characteristics - Commercial (74xx)
    8. 6.8 Switching Characteristics - Military (54xx)
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Balanced CMOS Push-Pull Outputs
    4. 8.4 Standard CMOS Inputs
    5. 8.5 Clamp Diode Structure
    6. 8.6 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

器件信息
器件型号 封装(1) 封装尺寸（标称值）
SN74HC00D SOIC (14) 8.70mm × 3.90mm
SN74HC00DB SSOP (14) 6.50mm × 5.30mm
SN74HC00N PDIP (14) 19.30mm × 6.40mm
SN74HC00NS SO (14) 10.20mm × 5.30mm
SN74HC00PW TSSOP (14) 5.00mm × 4.40mm
SN54HC00FK LCCC (20) 8.90mm × 8.90mm
SN54HC00J CDIP (14) 21.30mm × 7.60mm
SN54HC00W CFP (14) 9.20mm × 6.29mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。