4 Revision History
Changes from Revision C (February 2023) to Revision D (April 2023)
- 将 14 引脚 SOIC (D) 和 TSSOP (PW) 封装的状态从预发布 更改为正在供货
Go
Changes from Revision B (January 2023) to Revision C (February 2023)
- 将 5 引脚 SOT-23 和 8 引脚 SOIC 封装的状态从预发布 更改为正在供货
Go
Changes from Revision A (December 2022) to Revision B (January 2023)
- 删除了 SC70-5 (DCK) 封装的预发布标签Go
- Added OPA992-Q1 to the ESD Ratings section Go
- Changed the values in the Thermal Information table
Go
- Changed the max room temp offset voltage in Electrical Characteristics
section from 1 mV to 1.03 mVGo
Changes from Revision * (August 2022) to Revision A (December 2022)
- 将器件状态从预告信息 更改为 ProdMix
Go
- 删除了 VSSOP-8 (DGK) 封装的预发布标签Go