ZHCSDF6F October   2014  – December 2021 MSP430FR4131 , MSP430FR4132 , MSP430FR4133

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
    3. 7.3 Pin Multiplexing
    4. 7.4 Connection of Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Active Mode Supply Current Per MHz
    6. 8.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode LPM3, LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 8.10 Current Consumption Per Module
    11. 8.11 Thermal Characteristics
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1  Power Supply Sequencing
        1. 8.12.1.1 PMM, SVS and BOR
      2. 8.12.2  Reset Timing
        1. 8.12.2.1 Wake-up Times From Low-Power Modes and Reset
      3. 8.12.3  Clock Specifications
        1. 8.12.3.1 XT1 Crystal Oscillator (Low Frequency)
        2. 8.12.3.2 DCO FLL, Frequency
        3. 8.12.3.3 REFO
        4. 8.12.3.4 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. 8.12.3.5 Module Oscillator Clock (MODCLK)
      4. 8.12.4  Digital I/Os
        1. 8.12.4.1 Digital Inputs
        2. 8.12.4.2 Digital Outputs
        3. 8.12.4.3 Digital I/O Typical Characteristics
      5. 8.12.5  Timer_A
        1. 8.12.5.1 Timer_A
      6. 8.12.6  eUSCI
        1. 8.12.6.1 eUSCI (UART Mode) Operating Frequency
        2. 8.12.6.2 eUSCI (UART Mode) Switching Characteristics
        3. 8.12.6.3 eUSCI (SPI Master Mode) Operating Frequency
        4. 8.12.6.4 eUSCI (SPI Master Mode) Switching Characteristics
        5. 8.12.6.5 eUSCI (SPI Slave Mode) Switching Characteristics
        6. 8.12.6.6 eUSCI (I2C Mode) Switching Characteristics
      7. 8.12.7  ADC
        1. 8.12.7.1 ADC, Power Supply and Input Range Conditions
        2. 8.12.7.2 ADC, 10-Bit Timing Parameters
        3. 8.12.7.3 ADC, 10-Bit Linearity Parameters
      8. 8.12.8  LCD Controller
        1. 8.12.8.1 LCD Recommended Operating Conditions
      9. 8.12.9  FRAM
        1. 8.12.9.1 FRAM
      10. 8.12.10 Emulation and Debug
        1. 8.12.10.1 JTAG and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Bootloader (BSL)
    5. 9.5  JTAG Standard Interface
    6. 9.6  Spy-Bi-Wire Interface (SBW)
    7. 9.7  FRAM
    8. 9.8  Memory Protection
    9. 9.9  Peripherals
      1. 9.9.1  Power Management Module (PMM) and On-Chip Reference Voltages
      2. 9.9.2  Clock System (CS) and Clock Distribution
      3. 9.9.3  General-Purpose Input/Output Port (I/O)
      4. 9.9.4  Watchdog Timer (WDT)
      5. 9.9.5  System Module (SYS)
      6. 9.9.6  Cyclic Redundancy Check (CRC)
      7. 9.9.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 9.9.8  Timers (Timer0_A3, Timer1_A3)
      9. 9.9.9  Real-Time Clock (RTC) Counter
      10. 9.9.10 10-Bit Analog Digital Converter (ADC)
      11. 9.9.11 Liquid Crystal Display (LCD)
      12. 9.9.12 Embedded Emulation Module (EEM)
      13. 9.9.13 Input/Output Schematics
        1. 9.9.13.1  Port P1 Input/Output With Schmitt Trigger
        2. 9.9.13.2  Port P2 Input/Output With Schmitt Trigger
        3. 9.9.13.3  Port P3 Input/Output With Schmitt Trigger
        4. 9.9.13.4  Port P4.0 Input/Output With Schmitt Trigger
        5. 9.9.13.5  Port P4.1 and P4.2 Input/Output With Schmitt Trigger
        6. 9.9.13.6  Port 4.3, P4.4, P4.5, P4.6, and P4.7 Input/Output With Schmitt Trigger
        7. 9.9.13.7  Port P5.0, P5.1, P5.2, and P5.3 Input/Output With Schmitt Trigger
        8. 9.9.13.8  Port P5.4, P5.5, P5.6, and P5.7 Input/Output With Schmitt Trigger
        9. 9.9.13.9  Port P6 Input/Output With Schmitt Trigger
        10. 9.9.13.10 Port P7 Input/Output With Schmitt Trigger
        11. 9.9.13.11 Port P8.0 and P8.1 Input/Output With Schmitt Trigger
        12. 9.9.13.12 Port P8.2 and P8.3 Input/Output With Schmitt Trigger
    10. 9.10 Device Descriptors (TLV)
    11. 9.11 Memory
      1. 9.11.1 Peripheral File Map
    12. 9.12 Identification
      1. 9.12.1 Revision Identification
      2. 9.12.2 Device Identification
      3. 9.12.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Layout Guidelines
      2. 10.2.2 LCD_E Peripheral
        1. 10.2.2.1 Partial Schematic
        2. 10.2.2.2 Design Requirements
        3. 10.2.2.3 Detailed Design Procedure
        4. 10.2.2.4 Layout Guidelines
      3. 10.2.3 Timer
        1. 10.2.3.1 Generate Accurate PWM Using Internal Oscillator
    3. 10.3 Typical Applications
  11. 11Device and Documentation Support
    1. 11.1 Getting Started
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

MSP430FR41xx 超低功耗 (ULP) 微控制器系列支持低成本 LCD 应用，如远程控制、恒温器、智能仪表、血糖监测仪和血压监测仪等，该系列器件的集成 10 位 ADC 对这些应用的性能提升大有帮助。MCU 具有功能强大的 16 位 RISC CPU、16 位寄存器和常数发生器，有助于实现最大编码效率。数控振荡器 (DCO) 可使器件在不到 10μs 的时间内从低功耗模式唤醒至活动模式。此架构与多种低功耗模式配合使用，是延长便携式测量应用电池寿命的最优选择。

MSP430™ 微控制器平台将独特的嵌入式铁电随机存取存储器 (FRAM) 和全面的超低功耗系统架构相结合，从而使系统设计人员能够在降低能耗的同时提升性能。FRAM 技术将 RAM 的低功耗快速写入、灵活性和耐用性与闪存的非易失性相结合。

MSP430FR41x MCU 由一个由各种软、硬件资源组成的生态系统提供支持，并配套提供有参考设计和代码示例，可帮助您快速开展设计。适用于 MSP430FR41xx 的开发套件包括 MSP-EXP430FR4133LaunchPad™ 开发套件和 MSP-TS430PM64D 64 引脚目标开发板。TI 还提供免费的 MSP430Ware™ 软件，该软件以 Code Composer Studio™ IDE 桌面和云版本组件的形式提供（位于 TI Resource Explorer 中）。我们为 MSP430 MCU 提供广泛的在线配套资料（例如内务处理型示例系列、MSP Academy 培训），也通过 TI E2E™ 支持论坛提供在线支持。

有关完整的模块说明，请参阅《MSP430FR4xx 和 MSP430FR2xx 系列器件用户指南》。

器件信息
器件型号(1) 封装 封装尺寸(2)
MSP430FR4133IPM LQFP (64) 10mm x 10mm
MSP430FR4133IG56 TSSOP (56) 14mm x 6.1mm
MSP430FR4133IG48 TSSOP (48) 12.5mm x 6.1mm
(1) 要获得最新的产品、封装和订购信息，请参阅Section 12中的封装选项附录，或者访问德州仪器 (TI) 网站 www.ti.com.cn。
(2) 这里显示的尺寸为近似值。要获得包含误差值的封装尺寸，请参阅机械数据（Section 12中）。