ZHCSD40P April   2012  – January 2024 LP5907

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Output and Input Capacitors
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Low Output Noise
      3. 6.3.3 Output Automatic Discharge
      4. 6.3.4 Remote Output Capacitor Placement
      5. 6.3.5 Thermal Overload Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable (EN)
      2. 6.4.2 Minimum Operating Input Voltage (VIN)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Power Dissipation and Device Operation
        3. 7.2.2.3 External Capacitors
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Capacitor Characteristics
        7. 7.2.2.7 Remote Capacitor Operation
        8. 7.2.2.8 No-Load Stability
        9. 7.2.2.9 Enable Control
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 X2SON Mounting
        2. 7.4.1.2 DSBGA Mounting
        3. 7.4.1.3 DSBGA Light Sensitivity
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Custom Design With WEBENCH® Tools
      2. 8.1.2 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision O (June 2020) to Revision P (January 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 将文档标题中的超低噪声 更改为低噪声 Go
  • Added YCR to pinout caption of Pin Configuration and Functions sectionGo
  • Added YCR column to Thermal Information tableGo

Changes from Revision N (April 2018) to Revision O (June 2020)

  • 更改了应用部分Go
  • 更改了器件信息 表中的 DSBGA 封装尺寸Go
  • Added YKG to pinout caption of Pin Configuration and Functions sectionGo
  • Added YKG column to Thermal Information tableGo