ZHCSJT3B May   2019  – August 2020 LP5009 , LP5012

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM Control for Each Channel
        1. 8.3.1.1 Independent Color Mixing Per RGB LED Module
        2. 8.3.1.2 Independent Intensity Control Per RGB LED Module
          1. 8.3.1.2.1 Intensity-Control Register Configuration
          2. 8.3.1.2.2 Logarithmic- or Linear-Scale Intensity Control
        3. 8.3.1.3 12-Bit, 29-kHz PWM Generator Per Channel
          1. 8.3.1.3.1 PWM Generator
        4. 8.3.1.4 PWM Phase-Shifting
      2. 8.3.2 LED Bank Control
      3. 8.3.3 Current Range Setting
      4. 8.3.4 Automatic Power-Save Mode
      5. 8.3.5 Protection Features
        1. 8.3.5.1 Thermal Shutdown
        2. 8.3.5.2 UVLO
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 Start and Stop Conditions
        3. 8.5.1.3 Transferring Data
        4. 8.5.1.4 I2C Slave Addressing
        5. 8.5.1.5 Control-Register Write Cycle
        6. 8.5.1.6 Control-Register Read Cycle
        7. 8.5.1.7 Auto-Increment Feature
    6. 8.6 Register Maps
      1.      45
      2. 8.6.1  DEVICE_CONFIG0 (Address = 0h) [reset = 0h]
      3. 8.6.2  DEVICE_CONFIG1 (Address = 1h) [reset = 3Ch]
      4. 8.6.3  LED_CONFIG0 (Address = 2h) [reset = 00h]
      5. 8.6.4  BANK_BRIGHTNESS (Address = 3h) [reset = FFh]
      6. 8.6.5  BANK_A_COLOR (Address = 4h) [reset = 00h]
      7. 8.6.6  BANK_B_COLOR (Address = 5h) [reset = 00h]
      8. 8.6.7  BANK_C_COLOR (Address = 6h) [reset = 00h]
      9. 8.6.8  LED0_BRIGHTNESS (Address = 7h) [reset = FFh]
      10. 8.6.9  LED1_BRIGHTNESS (Address = 8h) [reset = FFh]
      11. 8.6.10 LED2_BRIGHTNESS (Address = 9h) [reset = FFh]
      12. 8.6.11 LED3_BRIGHTNESS (Address = 0Ah) [reset = FFh]
      13. 8.6.12 OUT0_COLOR (Address = 0Bh) [reset = 00h]
      14. 8.6.13 OUT1_COLOR (Address = 0Ch) [reset = 00h]
      15. 8.6.14 OUT2_COLOR (Address = 0Dh) [reset = 00h]
      16. 8.6.15 OUT3_COLOR (Address = 0Eh) [reset = 00h]
      17. 8.6.16 OUT4_COLOR (Address = 0Fh) [reset = 00h]
      18. 8.6.17 OUT5_COLOR (Address = 10h) [reset = 00h]
      19. 8.6.18 OUT6_COLOR (Address = 11h) [reset = 00h]
      20. 8.6.19 OUT7_COLOR (Address = 12h) [reset = 00h]
      21. 8.6.20 OUT8_COLOR (Address = 13h) [reset = 00h]
      22. 8.6.21 OUT9_COLOR (Address = 14h) [reset = 00h]
      23. 8.6.22 OUT10_COLOR (Address = 15h) [reset = 00h]
      24. 8.6.23 OUT11_COLOR (Address = 16h) [reset = 00h]
      25. 8.6.24 RESET (Address = 17h) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Functions

PINI/ODESCRIPTION
NAMERUK NO.

PW NO.

LP5009LP5012LP5009LP5012
ADDR01414

1

1

—I2C slave-address selection pin. This pin must not be left floating.
ADDR11515

3

3

—I2C slave-address selection pin. This pin must not be left floating.
EN1919

8

8

IChip enable input pin.
IREF2020

9

9

—Output current-reference global-setting pin.
NC11, 12, 13—

22, 23, 24

——No internal connection.
OUT022

12

12

OCurrent sink output 0. If not used, this pin can be left floating.
OUT133

13

13

OCurrent sink output 1. If not used, this pin can be left floating.
OUT244

14

14

OCurrent sink output 2. If not used, this pin can be left floating.
OUT355

15

15

OCurrent sink output 3. If not used, this pin can be left floating.
OUT466

16

16

OCurrent sink output 4. If not used, this pin can be left floating.
OUT577

17

17

OCurrent sink output 5. If not used, this pin can be left floating.
OUT688

19

19

OCurrent sink output 6. If not used, this pin can be left floating.
OUT799

20

20

OCurrent sink output 7. If not used, this pin can be left floating.
OUT81010

21

21

OCurrent sink output 8. If not used, this pin can be left floating.
OUT9—11

—

22

OCurrent sink output 9. If not used, this pin can be left floating.
OUT10—12—

23

OCurrent sink output 10. If not used, this pin can be left floating.
OUT11—13—

24

OCurrent sink output 11. If not used, this pin can be left floating.
SCL1818

7

7

II2C bus clock line. If not used, this pin must be connected to GND or VCC.
SDA1717

5

5

I/OI2C bus data line. If not used, this pin must be connected to GND or VCC.
VCAP11

10

10

—Internal LDO output pin, this pin must be connected to a 1-µF capacitor to GND. Place the capacitor as close to the device as possible.
VCC1616

4

4

—Power supply.
GNDThermal padThermal pad

—

——Exposed thermal pad also serves the ground pin for the WQFN package.

AGND

—

—

2

2

—

Analog circuits ground. AGND, PGND and DGND must be conntected together.

PGND

——

6

6

—

Power ground. AGND, PGND and DGND must be conntected together.

DGND

——

18

18

—

Digital circuits ground. AGND, PGND and DGND must be conntected together.