SNVS335F December   2006  – November 2016 LP38853

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Supply Sequencing
      3. 7.3.3 Reverse Voltage
      4. 7.3.4 Soft-Start
      5. 7.3.5 Setting The Output Voltage
      6. 7.3.6 Enable (EN) Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Voltage
      2. 7.4.2 Bias Voltage
      3. 7.4.3 Enable Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Input Capacitor
          2. 8.2.2.1.2 Output Capacitor
          3. 8.2.2.1.3 Bias Capacitor
          4. 8.2.2.1.4 Set The Output Voltage
          5. 8.2.2.1.5 Feed Forward Capacitor, CFF
        2. 8.2.2.2 Power Dissipation and Heat Sinking
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from E Revision (November 2015) to F Revision

  • corrected layout drawingsGo

Changes from D Revision (April 2015) to E Revision

  • Changed part number to LP38853 throughout data sheet Go
  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Lead temperature from Abs Max table; it is in POA Go
  • Added updated thermal information Go
  • Deleted out-of-date heatsinking subsections Go

Changes from C Revision (April 2013) to D Revision

  • Changed layout of National Data Sheet to TI formatGo