ZHCSD26E August   2012  – August 2018 LMZ21701

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
      2.      VIN = 12V 时的效率
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Package Construction
    4. 7.4 Feature Description
      1. 7.4.1 Input Undervoltage Lockout
      2. 7.4.2 Enable Input (EN)
      3. 7.4.3 Soft Start and Tracking Function (SS)
      4. 7.4.4 Power Good Function (PG)
      5. 7.4.5 Output Voltage Setting
      6. 7.4.6 Output Current Limit and Output Short Circuit Protection
      7. 7.4.7 Thermal Protection
    5. 7.5 Device Functional Modes
      1. 7.5.1 PWM Mode Operation
      2. 7.5.2 PSM Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Input Capacitor (CIN)
        3. 8.2.2.3 Output Capacitor (COUT)
        4. 8.2.2.4 Soft-start Capacitor (CSS)
        5. 8.2.2.5 Power Good Resistor (RPG)
        6. 8.2.2.6 Feedback Resistors (RFBB and RFBT)
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
        5. 8.2.3.5 VOUT = 5.0 V
    3. 8.3 Do's and Don'ts
  9. Power Supply Recommendations
    1. 9.1 Voltage Range
    2. 9.2 Current Capability
    3. 9.3 Input Connection
      1. 9.3.1 Voltage Drops
      2. 9.3.2 Stability
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Minimize the High di/dt Loop Area
      2. 10.1.2 Protect the Sensitive Nodes in the Circuit
      3. 10.1.3 Provide Thermal Path and Shielding
    2. 10.2 Layout Example
      1. 10.2.1 High Density Layout Example for Space Constrained Applications
        1. 10.2.1.1 35 mm² Solution Size (Single Sided)
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIL|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from D Revision () to E Revision

  • Added 添加了 Webench 链接和 TI 参考设计顶部导航图标;删除了Simple Switcher 品牌Go
  • Changed Handling Ratings to ESD RatingsGo

Changes from C Revision (October 2014) to D Revision

  • Changed 将“产品概述”更改成了“生产数据”Go
  • Changed to Final Limits Go

Changes from B Revision (August 2014) to C Revision

  • Added 添加了“器件信息”表和“处理额定值”表、“特性 说明”、“应用和实施”、“布局”、“器件和文档支持”以及“机械、封装和可订购信息”,将一些曲线移到了“应用曲线”中Go

Changes from A Revision (October 2013) to B Revision

  • 已将数据表更改为最新 TI 标准Go

Changes from * Revision (August 2012) to A Revision

  • Changed 说明Go