ZHCSEI5A March   2013  – January 2016 LMX2485Q-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - Commercial
    3. 6.3 ESD Ratings - Automotive
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
      1. 6.8.1 Sensitivity
      2. 6.8.2 FinRF Input Impedance
      3. 6.8.3 FinIF Input Impedance
      4. 6.8.4 OSCin Input Impedance
      5. 6.8.5 Currents
  7. 7 Parameter Measurement Information
    1. 7.1 Bench Test Set-Ups
      1. 7.1.1 Charge Pump Current Measurement Procedure
      2. 7.1.2 Charge Pump Current Specification Definitions
        1. 7.1.2.1 Charge Pump Output Current Variation vs Charge Pump Output Voltage
        2. 7.1.2.2 Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
        3. 7.1.2.3 Charge Pump Output Current Variation vs Temperature
      3. 7.1.3 Sensitivity Measurement Procedure
      4. 7.1.4 Input Impedance Measurement Procedure
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Tcxo, Oscillator Buffer, and R Counter
      2. 8.3.2 Phase Detector
      3. 8.3.3 Charge Pump
      4. 8.3.4 Loop Filter
      5. 8.3.5 N Counters and High Frequency Input Pins
        1. 8.3.5.1 High Frequency Input Pins, FinRF and FinIF
        2. 8.3.5.2 Complementary High Frequency Pin, FinRF*
      6. 8.3.6 Digital Lock Detect Operation
      7. 8.3.7 Cycle Slip Reduction and Fastlock
        1. 8.3.7.1 Cycle Slip Reduction (CSR)
        2. 8.3.7.2 Fastlock
        3. 8.3.7.3 Using Cycle Slip Reduction (CSR) to Avoid Cycle Slipping
        4. 8.3.7.4 Using Fastlock to Improve Lock Times
        5. 8.3.7.5 Capacitor Dielectric Considerations for Lock Time
      8. 8.3.8 Fractional Spur and Phase Noise Controls
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Pins, Power Down, and Power Up Modes
    5. 8.5 Programming
      1. 8.5.1 Register Location Truth Table
      2. 8.5.2 Control Register Content Map
    6. 8.6 Register Maps
      1. 8.6.1 R0 Register
      2. 8.6.2 R1 Register
      3. 8.6.3 R2 Register
      4. 8.6.4 R3 Register
      5. 8.6.5 R4 Register
      6. 8.6.6 R5 Register
      7. 8.6.7 R6 Register
      8. 8.6.8 R7 Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 社区资源
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RTW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from * Revision (March 2013) to A Revision

  • 已添加引脚配置和功能部分，ESD 额定值表，特性 描述 部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go