ZHCSE54 September   2015 LMH0318

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Recommended SMBus Interface AC Timing Specifications
    7. 7.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Loss of Signal Detector
      2. 8.3.2 Continuous Time Linear Equalizer (CTLE)
      3. 8.3.3 2:1 Multiplexer
      4. 8.3.4 Clock and Data Recovery
      5. 8.3.5 Eye Opening Monitor (EOM)
      6. 8.3.6 Fast EOM
        1. 8.3.6.1 SMBus Fast EOM Operation
        2. 8.3.6.2 SPI Fast EOM Operation
      7. 8.3.7 LMH0318 Device Configuration
        1. 8.3.7.1 MODE_SEL
        2. 8.3.7.2 ENABLE
        3. 8.3.7.3 LOS_INT_N
        4. 8.3.7.4 LOCK
        5. 8.3.7.5 SMBus MODE
        6. 8.3.7.6 SMBus READ/WRITE Transaction
        7. 8.3.7.7 SPI Mode
          1. 8.3.7.7.1 SPI READ/WRITE Transaction
          2. 8.3.7.7.2 SPI Write Transaction Format
          3. 8.3.7.7.3 SPI Read Transaction Format
        8. 8.3.7.8 SPI Daisy Chain
          1. 8.3.7.8.1 SPI Daisy Chain Write Example
          2. 8.3.7.8.2 SPI Daisy Chain Write Read Example
            1. 8.3.7.8.2.1 SPI Daisy Chain Length of Daisy Chain Illustration
      8. 8.3.8 Power-On Reset
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Register Maps
      2. 8.5.2 Global Registers
      3. 8.5.3 Receiver Registers
      4. 8.5.4 CDR Registers
      5. 8.5.5 Transmitter Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Guidance for All Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Set Up
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Solder Profile
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档　
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

日期 修订版本 注释
2015 年 9 月 * 首次发布。