ZHCSSU9
September 2023
LM70880-Q1
ADVANCE INFORMATION
1
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
6.3
接收文档更新通知
6.4
支持资源
6.5
Trademarks
6.6
静电放电警告
6.7
术语表
7
Mechanical, Packaging, and Orderable Information
7.1
Tape and Reel Information
封装选项
机械数据 (封装 | 引脚)
RRX|29
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcssu9_oa
6.2.1.2
Thermal Design Resources
Application notes:
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
PowerPAD Made Easy
Texas Instruments,
Using New Thermal Metrics