ZHCSSM7D May   1998  – November 2023 LM6171

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: ±15 V
    6. 5.6 Electrical Characteristics: ±5 V
    7. 5.7 Typical Characteristics: LM6171A Only
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Circuit Operation
      2. 6.3.2 Slew Rate
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Compensation for Input Capacitance
      2. 7.1.2 Power Supply Bypassing
      3. 7.1.3 Termination
      4. 7.1.4 Driving Capacitive Loads
      5. 7.1.5 Using Probes
      6. 7.1.6 Components Selection and Feedback Resistor
    2. 7.2 Typical Applications
      1. 7.2.1 Fast Instrumentation Amplifier
      2. 7.2.2 Multivibrator
      3. 7.2.3 Pulse Width Modulator
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Dissipation
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Printed Circuit Boards and High-Speed Op Amps
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) LM6171 UNIT
D (SOIC) A Version D (SOIC) B Version P (PDIP)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 122.5 172 108 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 64.7 62.4 52.4 ℃/W
RθJB Junction-to-board thermal resistance 65.9 55.7 51.9 ℃/W
ΨJT Junction-to-top characterization parameter 17.6 16.5 6.8 ℃/W
ΨJB Junction-to-board characterization parameter 65.1 55.1 51.1 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A ℃/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.