ZHCSL47A
April 2020 – January 2021
LM5181
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Integrated Power MOSFET
8.3.2
PSR Flyback Modes of Operation
8.3.3
Setting the Output Voltage
8.3.3.1
Diode Thermal Compensation
8.3.4
Control Loop Error Amplifier
8.3.5
Precision Enable
8.3.6
Configurable Soft Start
8.3.7
External Bias Supply
8.3.8
Minimum On-Time and Off-Time
8.3.9
Overcurrent Protection
8.3.10
Thermal Shutdown
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Design 1: Wide VIN, Low IQ PSR Flyback Converter Rated at 5 V, 0.5 A
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Custom Design With WEBENCH® Tools
9.2.1.2.2
Custom Design With Excel Quickstart Tool
9.2.1.2.3
Flyback Transformer – T1
9.2.1.2.4
Flyback Diode – DFLY
9.2.1.2.5
Zener Clamp Circuit – DF, DCLAMP
9.2.1.2.6
Output Capacitor – COUT
9.2.1.2.7
Input Capacitor – CIN
9.2.1.2.8
Feedback Resistor – RFB
9.2.1.2.9
Thermal Compensation Resistor – RTC
9.2.1.2.10
UVLO Resistors – RUV1, RUV2
9.2.1.2.11
Soft-Start Capacitor – CSS
9.2.2
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Examples
12
Device and Documentation Support
12.1
Device Support
12.1.1
第三方产品免责声明
12.1.2
Development Support
12.1.2.1
Custom Design With WEBENCH® Tools
12.2
Documentation Support
12.2.1
Related Documentation
12.3
接收文档更新通知
12.4
支持资源
12.5
Trademarks
12.6
静电放电警告
12.7
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
NGU|8
MPDS407A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsl47a_oa
zhcsl47a_pm
12.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。