ZHCSDJ1
March 2015
LM36923
PRODUCTION DATA.
1
特性
2
应用
3
说明
4
修订历史记录
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
I2CTiming Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Enabling the LM36923
7.3.1.1
Current Sink Enable
7.3.2
LM36923 Start-Up
7.3.3
Brightness Mapping
7.3.3.1
Linear Mapping
7.3.3.2
Exponential Mapping
7.3.4
PWM Input
7.3.4.1
PWM Sample Frequency
7.3.4.1.1
PWM Resolution and Input Frequency Range
7.3.4.1.2
PWM Sample Rate and Efficiency
7.3.4.1.2.1
PWM Sample Rate Example
7.3.4.2
PWM Hysteresis
7.3.4.3
PWM Step Response
7.3.4.4
PWM Timeout
7.3.5
LED Current Ramping
7.3.6
Regulated Headroom Voltage
7.4
Device Functional Modes
7.4.1
Brightness Control Modes
7.4.1.1
I2C Only (Brightness Mode 00)
7.4.1.2
PWM Only (Brightness Mode 01)
7.4.1.3
I2C + PWM Brightness Control (Multiply Then Ramp) Brightness Mode 10
7.4.1.4
I2C + PWM Brightness Control (Ramp Then Multiply) Brightness Mode 11
7.4.2
Boost Switching Frequency
7.4.2.1
Minimum Inductor Select
7.4.3
Auto Switching Frequency
7.4.4
Backlight Adjust Input (BL_ADJ)
7.4.4.1
Back-Light Adjust Input Polarity
7.4.5
Fault Protection/Detection
7.4.5.1
Overvoltage Protection (OVP)
7.4.5.1.1
Case 1 OVP Fault Only (OVP Threshold Hit and All Enabled Current Sink Inputs > 40 mV)
7.4.5.1.2
Case 2a OVP Fault and Open LED String Fault (OVP Threshold Occurrence and Any Enabled Current Sink Input ≤ 40 mV)
7.4.5.1.3
Case 2b OVP Fault and Open LED String Fault (OVP Threshold Duration and Any Enabled Current Sink Input ≤ 40 mV)
7.4.5.1.4
OVP/LED Open Fault Shutdown
7.4.5.1.5
Testing for LED String Open
7.4.5.2
LED String Short Fault
7.4.5.3
Overcurrent Protection (OCP)
7.4.5.3.1
OCP Fault
7.4.5.3.2
OCP Shutdown
7.4.5.4
Device Overtemperature (TSD)
7.4.5.4.1
Overtemperature Shutdown
7.5
Programming
7.5.1
I2C Interface
7.5.1.1
Start and Stop Conditions
7.5.1.2
I2C Address
7.5.1.3
Transferring Data
7.5.1.4
Register Programming
7.6
Register Maps
8
Applications and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Component Selection
8.2.2.1.1
Inductor
8.2.2.1.2
Output Capacitor
8.2.2.1.3
Input Capacitor
8.2.3
Application Curves
9
Power Supply Recommendations
9.1
Input Supply Bypassing
10
Layout
10.1
Layout Guidelines
10.1.1
Boost Output Capacitor Placement
10.1.2
Schottky Diode Placement
10.1.3
Inductor Placement
10.1.4
Boost Input Capacitor Placement
10.2
Layout Example
11
器件和文档支持
11.1
器件支持
11.1.1
第三方产品免责声明
11.2
商标
11.3
静电放电警告
11.4
术语表
12
机械封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
YFF|12
MXBG343
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsdj1_oa
4 修订历史记录
日期
修订版本
注释
2015 年 3 月
*
最初发布。