ZHCSDJ1 March   2015 LM36923

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2CTiming Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enabling the LM36923
        1. 7.3.1.1 Current Sink Enable
      2. 7.3.2 LM36923 Start-Up
      3. 7.3.3 Brightness Mapping
        1. 7.3.3.1 Linear Mapping
        2. 7.3.3.2 Exponential Mapping
      4. 7.3.4 PWM Input
        1. 7.3.4.1 PWM Sample Frequency
          1. 7.3.4.1.1 PWM Resolution and Input Frequency Range
          2. 7.3.4.1.2 PWM Sample Rate and Efficiency
            1. 7.3.4.1.2.1 PWM Sample Rate Example
        2. 7.3.4.2 PWM Hysteresis
        3. 7.3.4.3 PWM Step Response
        4. 7.3.4.4 PWM Timeout
      5. 7.3.5 LED Current Ramping
      6. 7.3.6 Regulated Headroom Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Brightness Control Modes
        1. 7.4.1.1 I2C Only (Brightness Mode 00)
        2. 7.4.1.2 PWM Only (Brightness Mode 01)
        3. 7.4.1.3 I2C + PWM Brightness Control (Multiply Then Ramp) Brightness Mode 10
        4. 7.4.1.4 I2C + PWM Brightness Control (Ramp Then Multiply) Brightness Mode 11
      2. 7.4.2 Boost Switching Frequency
        1. 7.4.2.1 Minimum Inductor Select
      3. 7.4.3 Auto Switching Frequency
      4. 7.4.4 Backlight Adjust Input (BL_ADJ)
        1. 7.4.4.1 Back-Light Adjust Input Polarity
      5. 7.4.5 Fault Protection/Detection
        1. 7.4.5.1 Overvoltage Protection (OVP)
          1. 7.4.5.1.1 Case 1 OVP Fault Only (OVP Threshold Hit and All Enabled Current Sink Inputs > 40 mV)
          2. 7.4.5.1.2 Case 2a OVP Fault and Open LED String Fault (OVP Threshold Occurrence and Any Enabled Current Sink Input ≤ 40 mV)
          3. 7.4.5.1.3 Case 2b OVP Fault and Open LED String Fault (OVP Threshold Duration and Any Enabled Current Sink Input ≤ 40 mV)
          4. 7.4.5.1.4 OVP/LED Open Fault Shutdown
          5. 7.4.5.1.5 Testing for LED String Open
        2. 7.4.5.2 LED String Short Fault
        3. 7.4.5.3 Overcurrent Protection (OCP)
          1. 7.4.5.3.1 OCP Fault
          2. 7.4.5.3.2 OCP Shutdown
        4. 7.4.5.4 Device Overtemperature (TSD)
          1. 7.4.5.4.1 Overtemperature Shutdown
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Start and Stop Conditions
        2. 7.5.1.2 I2C Address
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 Register Programming
    6. 7.6 Register Maps
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Inductor
          2. 8.2.2.1.2 Output Capacitor
          3. 8.2.2.1.3 Input Capacitor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Bypassing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Boost Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类产品或服务单独或与任何 TI 产品或服务一起的表示或认可。

11.2 商标

All other trademarks are the property of their respective owners.

11.3 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.4 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。