ZHCSE58C April   2012  – September 2015 LM3533

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Bank Mapping
        1. 7.3.1.1 High-Voltage Control Banks (A/B)
        2. 7.3.1.2 Low-Voltage Control Banks (C, D, E, And F)
      2. 7.3.2 Pattern Generator
      3. 7.3.3 Ambient Light Sensor Interface
      4. 7.3.4 PWM Input
      5. 7.3.5 HWEN Input
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1  High-Voltage Boost Converter
        1. 7.4.1.1 High-Voltage Current Sinks (HVLED1 And HVLED2)
        2. 7.4.1.2 High-Voltage Current String Biasing
        3. 7.4.1.3 Boost Switching-Frequency Select
      2. 7.4.2  Integrated Charge Pump
        1. 7.4.2.1 Charge Pump Disabled
        2. 7.4.2.2 Automatic Gain
        3. 7.4.2.3 Automatic Gain (Flying Capacitor Detection)
        4. 7.4.2.4 1× Gain
        5. 7.4.2.5 2× Gain
        6. 7.4.2.6 Low-Voltage Current Sinks (LVLED1 to LVLED5)
        7. 7.4.2.7 Low-Voltage LED Biasing
      3. 7.4.3  LED Current Mapping Modes
        1. 7.4.3.1 Exponential Mapping
        2. 7.4.3.2 Linear Mapping
      4. 7.4.4  LED Current Ramping
        1. 7.4.4.1 Start-Up/Shutdown Ramp
        2. 7.4.4.2 Run-Time Ramp
      5. 7.4.5  Brightness Register Current Control
      6. 7.4.6  PWM Control
        1. 7.4.6.1 PWM Input Frequency Range
        2. 7.4.6.2 PWM Input Polarity
      7. 7.4.7  ALS Current Control
        1. 7.4.7.1 ALS Brightness Zones (Zone Boundaries)
        2. 7.4.7.2 Zone Boundary Hysteresis
        3. 7.4.7.3 Zone Target Registers (ALSM1, ALSM2, ALSM3)
        4. 7.4.7.4 PWM Input in ALS Mode
      8. 7.4.8  ALS Functional Blocks
        1. 7.4.8.1  ALS Input
        2. 7.4.8.2  Analog Output Ambient Light Sensors (ALS Gain Setting Resistors)
        3. 7.4.8.3  PWM Output Ambient Light Sensors (Internal Filtering)
        4. 7.4.8.4  Internal 8-Bit ADC
        5. 7.4.8.5  ALS Averager
        6. 7.4.8.6  Initializing the ALS
        7. 7.4.8.7  ALS Algorithms
        8. 7.4.8.8  ALS Rules
        9. 7.4.8.9  Direct ALS Control
        10. 7.4.8.10 Up-Only Control
        11. 7.4.8.11 Down-Delay Control
      9. 7.4.9  Pattern Generator
        1. 7.4.9.1 Delay Time
        2. 7.4.9.2 Rise Time
        3. 7.4.9.3 Fall Time
        4. 7.4.9.4 High Period
        5. 7.4.9.5 Low Period
        6. 7.4.9.6 Low-Level Brightness
        7. 7.4.9.7 High-Level Brightness
        8. 7.4.9.8 ALS Controlled Pattern Current
        9. 7.4.9.9 Interrupt Output Mode
      10. 7.4.10 Fault Flags/Protection Features
        1. 7.4.10.1 Open LED String (HVLED)
        2. 7.4.10.2 Shorted LED String (HVLED)
        3. 7.4.10.3 Open LED (LVLED)
        4. 7.4.10.4 Shorted LED (LVLED)
        5. 7.4.10.5 Overvoltage Protection (Inductive Boost)
        6. 7.4.10.6 Current Limit (Inductive Boost)
        7. 7.4.10.7 Current Limit (Charge Pump)
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Start and Stop Conditions
        2. 7.5.1.2 I2C-Compatible Address
        3. 7.5.1.3 Transferring Data
    6. 7.6 Register Maps
      1. 7.6.1 LM3533 Register Descriptions
        1. 7.6.1.1 Pattern Generator Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Boost Converter Maximum Output Power (Boost)
        2. 8.2.2.2 Peak Current Limited
        3. 8.2.2.3 Output Voltage Limited
        4. 8.2.2.4 Maximum Output Power (Charge Pump)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost
        1. 10.1.1.1 Boost Output Capacitor Selection and Placement
        2. 10.1.1.2 Schottky Diode Placement
        3. 10.1.1.3 Inductor Placement
        4. 10.1.1.4 Boost Input Capacitor Selection and Placement
      2. 10.1.2 Charge Pump
        1. 10.1.2.1 Flying Capacitor (CP)
        2. 10.1.2.2 Output Capacitor (CPOUT)
        3. 10.1.2.3 Charge Pump Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 相关文档　
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 相关文档　

更多信息，请参见以下文档：

德州仪器 (TI) 应用手册 AN-1112《DSBGA 晶圆级芯片规模封装》（文献编号：SNVA009）。

11.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.