ZHCSF02 April   2016 LDC1612-Q1 , LDC1614-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics - I2C
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clocking Architecture
      2. 8.3.2 Multi-Channel and Single Channel Operation
      3. 8.3.3 Current Drive Control Registers
      4. 8.3.4 Device Status Registers
      5. 8.3.5 Input Deglitch Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 Startup Mode
      2. 8.4.2 Normal (Conversion) Mode
      3. 8.4.3 Sleep Mode
      4. 8.4.4 Shutdown Mode
        1. 8.4.4.1 Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Specifications
    6. 8.6 Register Maps
      1. 8.6.1  Register List
      2. 8.6.2  Address 0x00, DATA_MSB_CH0
      3. 8.6.3  Address 0x01, DATA_LSB_CH0
      4. 8.6.4  Address 0x02, DATA_MSB_CH1
      5. 8.6.5  Address 0x03, DATA_LSB_CH1
      6. 8.6.6  Address 0x04, DATA_MSB_CH2 (LDC1614 only)
      7. 8.6.7  Address 0x05, DATA_LSB_CH2 (LDC1614 only)
      8. 8.6.8  Address 0x06, DATA_MSB_CH3 (LDC1614 only)
      9. 8.6.9  Address 0x07, DATA_LSB_CH3 (LDC1614 only)
      10. 8.6.10 Address 0x08, RCOUNT_CH0
      11. 8.6.11 Address 0x09, RCOUNT_CH1
      12. 8.6.12 Address 0x0A, RCOUNT_CH2 (LDC1614 only)
      13. 8.6.13 Address 0x0B, RCOUNT_CH3 (LDC1614 only)
      14. 8.6.14 Address 0x0C, OFFSET_CH0
      15. 8.6.15 Address 0x0D, OFFSET_CH1
      16. 8.6.16 Address 0x0E, OFFSET_CH2 (LDC1614 only)
      17. 8.6.17 Address 0x0F, OFFSET_CH3 (LDC1614 only)
      18. 8.6.18 Address 0x10, SETTLECOUNT_CH0
      19. 8.6.19 Address 0x11, SETTLECOUNT_CH1
      20. 8.6.20 Address 0x12, SETTLECOUNT_CH2 (LDC1614 only)
      21. 8.6.21 Address 0x13, SETTLECOUNT_CH3 (LDC1614 only)
      22. 8.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
      23. 8.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
      24. 8.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (LDC1614 only)
      25. 8.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (LDC1614 only)
      26. 8.6.26 Address 0x18, STATUS
      27. 8.6.27 Address 0x19, ERROR_CONFIG
      28. 8.6.28 Address 0x1A, CONFIG
      29. 8.6.29 Address 0x1B, MUX_CONFIG
      30. 8.6.30 Address 0x1C, RESET_DEV
      31. 8.6.31 Address 0x1E, DRIVE_CURRENT_CH0
      32. 8.6.32 Address 0x1F, DRIVE_CURRENT_CH1
      33. 8.6.33 Address 0x20, DRIVE_CURRENT_CH2 (LDC1614 only)
      34. 8.6.34 Address 0x21, DRIVE_CURRENT_CH3 (LDC1614 only)
      35. 8.6.35 Address 0x7E, MANUFACTURER_ID
      36. 8.6.36 Address 0x7F, DEVICE_ID
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Theory of Operation
        1. 9.1.1.1 Conductive Objects in an EM Field
        2. 9.1.1.2 L-C Resonators
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Recommended Initial Register Configuration Values
        2. 9.2.2.2 Inductor Self-Resonant Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档 
    3. 12.3 社区资源
    4. 12.4 相关链接
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 说明 (续)

高分辨率通道可支持更大的感测范围,在两倍线圈直径范围外依然可保持良好的性能。良好匹配的通道支持差分与比率测量,因此,设计人员能够利用一个通道来补偿感测过程中的环境条件和老化条件,例如温度、湿度和机械漂移等。

得益于易用、低能耗、低系统成本等特性,这些产品有助于设计人员大幅提高现有传感解决方案的性能、可靠性和灵活性,从而为所有市场(尤其是消费品和工业应用)中的产品引入全新的感测 功能。。

这些器件可以通过 I2C 接口轻松进行配置。双通道 LDC1612-Q1 采用 WSON-12 封装,四通道 LDC1614-Q1 采用 WQFN-16 封装。