ZHCSUL9
February 2024
ESD562
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings - JEDEC Specifications
5.3
ESD Ratings - IEC Specifications
5.4
Recommended Operating Conditions
5.5
Thermal Information
5.6
Electrical Characteristics
5.7
Typical Characteristics
6
Application and Implementation
6.1
Application Information
7
Device and Documentation Support
7.1
Documentation Support
7.1.1
Related Documentation
7.2
接收文档更新通知
7.3
支持资源
7.4
Trademarks
7.5
静电放电警告
7.6
术语表
8
Revision History
9
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DBZ|3
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsul9_oa
zhcsul9_pm
5.7
Typical Characteristics
Figure 5-1
Capacitance vs. Bias Voltage.
Figure 5-2
8/20μs Surge Response
Figure 5-3
+8kV Clamped IEC Waveform
Figure 5-4
-8kV Clamped IEC Waveform
Figure 5-5
Positive TLP Curve
Figure 5-6
Negative TLP Curve
Figure 5-7
DC Voltage Sweep I-V Curve
Figure 5-8
Leakage Current vs Temperature