SNOSB66B August   2011  – November 2014 EMB1412

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. Detailed Description
    1. 7.1 Overview
  8. Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Thermal Performance
  9. Device and Documentation Support
    1. 9.1 Trademarks
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

VSSOP (DGN)
8 Pins
Top View
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Pin Functions

PIN NAME DESCRIPTION APPLICATION INFORMATION
1 IN_REF Ground reference for control inputs Connect to power ground (VEE) for standard positive only output voltage swing. Connect to system logic ground when VEE is connected to a negative gate drive supply.
2 INB Inverting input pin TTL compatible thresholds. Connect to IN_REF when not used.
3 VEE Power ground for driver outputs Connect to either power ground or a negative gate drive supply for positive or negative voltage swing.
4 IN Non-inverting input pin TTL compatible thresholds. Pull up to VCC when not used.
5, 8 N/C Not internally connected
6 VCC Positive Supply voltage input Locally decouple to VEE. The decoupling capacitor should be located close to the chip.
7 OUT Gate drive output Capable of sourcing 3 A and sinking 7 A. Voltage swing of this output is from VEE to VCC.
- - - Exposed Pad Exposed Pad, underside of package Internally bonded to the die substrate. Connect to VEE ground pin for low thermal impedance.