ZHCSDA4C November   2012  – January 2015 DS90UH927Q-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC and AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing Requirements for the Serial Control Bus
    9. 6.9  Timing Requirements
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Speed Forward Channel Data Transfer
      2. 7.3.2  Low-Speed Back Channel Data Transfer
      3. 7.3.3  Common Mode Filter Pin (CMF)
      4. 7.3.4  Video Control Signals
      5. 7.3.5  EMI Reduction Features
        1. 7.3.5.1 LVCMOS VDDIO Option
      6. 7.3.6  Built-In Self Test (BIST)
        1. 7.3.6.1 BIST Configuration and Status
      7. 7.3.7  Forward Channel and Back Channel Error Checking
      8. 7.3.8  Internal Pattern Generation
        1. 7.3.8.1 Pattern Options
        2. 7.3.8.2 Color Modes
        3. 7.3.8.3 Video Timing Modes
        4. 7.3.8.4 External Timing
        5. 7.3.8.5 Pattern Inversion
        6. 7.3.8.6 Auto Scrolling
      9. 7.3.9  Remote Auto Power Down Mode
      10. 7.3.10 Input RxCLKIN Loss Detect
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 INTERRUPT Pin (INTB)
      13. 7.3.13 General-Purpose I/O
        1. 7.3.13.1 GPIO[3:0]
        2. 7.3.13.2 GPIO[8:5]
      14. 7.3.14 I2S Audio Interface
        1. 7.3.14.1 I2S Transport Modes
        2. 7.3.14.2 I2S Repeater
      15. 7.3.15 Additional Features
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down (PDB)
      2. 7.4.2 Backward Compatible Mode
      3. 7.4.3 Low Frequency Optimization (LFMODE)
      4. 7.4.4 FPD-Link Input Frame and Color Bit Mapping Select
      5. 7.4.5 HDCP
        1. 7.4.5.1 HDCP Repeater
        2. 7.4.5.2 HDCP I2S Audio Encryption
        3. 7.4.5.3 Repeater Configuration
        4. 7.4.5.4 Repeater Connections
          1. 7.4.5.4.1 Repeater Fan-Out Electrical Requirements
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 CML Interconnect Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (June 2013) to C Revision

  • Added ESD 额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go

Changes from A Revision (November 2012) to B Revision

  • Changed layout of National data sheet to TI formatGo