ZHCSEV0 March   2016 DS90UB921-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - JEDEC
    3. 6.3  ESD Ratings—IEC and ISO
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  PCLK Timing Requirements
    9. 6.9  Recommended Timing for the Serial Control Bus
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Charateristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Speed Forward Channel Data Transfer
      2. 7.3.2  Low Speed Back Channel Data Transfer
      3. 7.3.3  Common Mode Filter Pin (CMF)
      4. 7.3.4  Video Control Signal Filter
      5. 7.3.5  EMI Reduction Features
        1. 7.3.5.1 Input SSC Tolerance (SSCT)
      6. 7.3.6  LVCMOS VDDIO Option
      7. 7.3.7  Power Down (PDB)
      8. 7.3.8  Remote Auto Power-Down Mode
      9. 7.3.9  Input PCLK Loss Detect
      10. 7.3.10 Serial Link Fault Detect
      11. 7.3.11 Pixel Clock Edge Select (TRFB)
      12. 7.3.12 Frequency Mode Optimizations
      13. 7.3.13 Interrupt Pins - Funtional Description and Usage (INTB, REM_INTB)
      14. 7.3.14 Internal Pattern Generation
      15. 7.3.15 GPIO[3:0] and GPO_REG[7:4]
        1. 7.3.15.1 GPIO[3:0] Enable Sequence
        2. 7.3.15.2 GPO_REG[7:4] Enable Sequence
      16. 7.3.16 I2S Transmitting
      17. 7.3.17 Built In Self Test (BIST)
        1. 7.3.17.1 BIST Configuration and Status
          1. 7.3.17.1.1 Sample BIST Sequence
        2. 7.3.17.2 Forward Channel And Back Channel Error Checking
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select (MODE_SEL)
      2. 7.4.2 Repeater Application
        1. 7.4.2.1 Repeater Configuration
        2. 7.4.2.2 Repeater Connections
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 AVMUTE Operation
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Up Requirements and PDB Pin
    2. 9.2 CML Interconnect Guidelines
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

日期 修订版本 注释
2016 年 3 月 * 最初发布版本。