ZHCSEV0 March   2016 DS90UB921-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - JEDEC
    3. 6.3  ESD Ratings—IEC and ISO
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  PCLK Timing Requirements
    9. 6.9  Recommended Timing for the Serial Control Bus
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Charateristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Speed Forward Channel Data Transfer
      2. 7.3.2  Low Speed Back Channel Data Transfer
      3. 7.3.3  Common Mode Filter Pin (CMF)
      4. 7.3.4  Video Control Signal Filter
      5. 7.3.5  EMI Reduction Features
        1. 7.3.5.1 Input SSC Tolerance (SSCT)
      6. 7.3.6  LVCMOS VDDIO Option
      7. 7.3.7  Power Down (PDB)
      8. 7.3.8  Remote Auto Power-Down Mode
      9. 7.3.9  Input PCLK Loss Detect
      10. 7.3.10 Serial Link Fault Detect
      11. 7.3.11 Pixel Clock Edge Select (TRFB)
      12. 7.3.12 Frequency Mode Optimizations
      13. 7.3.13 Interrupt Pins - Funtional Description and Usage (INTB, REM_INTB)
      14. 7.3.14 Internal Pattern Generation
      15. 7.3.15 GPIO[3:0] and GPO_REG[7:4]
        1. 7.3.15.1 GPIO[3:0] Enable Sequence
        2. 7.3.15.2 GPO_REG[7:4] Enable Sequence
      16. 7.3.16 I2S Transmitting
      17. 7.3.17 Built In Self Test (BIST)
        1. 7.3.17.1 BIST Configuration and Status
          1. 7.3.17.1.1 Sample BIST Sequence
        2. 7.3.17.2 Forward Channel And Back Channel Error Checking
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select (MODE_SEL)
      2. 7.4.2 Repeater Application
        1. 7.4.2.1 Repeater Configuration
        2. 7.4.2.2 Repeater Connections
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 AVMUTE Operation
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Up Requirements and PDB Pin
    2. 9.2 CML Interconnect Guidelines
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 文档支持

11.1.1 相关文档　

  • 《AN-2198 探究内部测试模式生成》，SNLA132
  • 《AN-1108 通道链路 PCB 和互连设计指南》，SNLA008
  • 《SCAN18245T 具有三态输出的同向收发器》，SNLA035
  • TI 接口网站 www.ti.com.cn/lvds
  • 《AN-1187 无引线框架封装 (LLP)》，SNOA401
  • 《半导体和 IC 封装热指标》，SPRA953

11.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 商标

E2E is a trademark of Texas Instruments.

11.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.