ZHCSLS8 August   2020 DRV5825P

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
      1. 6.7.1 Bridge Tied Load (BTL) Configuration
      2. 6.7.2 Parallel Bridge Tied Load (PBTL) Configuration
  7. 7 Typical Characteristics
    1. 7.1 Bridge Tied Load (BTL) Configuration
    2. 7.2 Parallel Bridge Tied Load (PBTL) Configuration
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supplies
      2. 8.3.2 Device Clocking
      3. 8.3.3 Serial Audio Port – Clock Rates
      4. 8.3.4 Clock Halt Auto-recovery
      5. 8.3.5 Sample Rate on the Fly Change
      6. 8.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 8.3.7 Digital Audio Processing
      8. 8.3.8 Class D Audio Amplifier
        1. 8.3.8.1 Speaker Amplifier Gain Select
        2. 8.3.8.2 Class D Loop Bandwidth and Switching Frequency Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Software Control
      2. 8.4.2 Speaker Amplifier Operating Modes
        1. 8.4.2.1 BTL Mode
        2. 8.4.2.2 PBTL Mode
      3. 8.4.3 Low EMI Modes
        1. 8.4.3.1 Spread Spectrum
        2. 8.4.3.2 Channel to Channel Phase Shift
        3. 8.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 8.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 8.4.3.3.2 Phase Synchronization With GPIO
      4. 8.4.4 Device State Control
      5. 8.4.5 Device Modulation
    5. 8.5 Programming and Control
      1. 8.5.1 I2C Serial Communication Bus
      2. 8.5.2 I2C Slave Address
        1. 8.5.2.1 Random Write
        2. 8.5.2.2 Sequential Write
        3. 8.5.2.3 Random Read
        4. 8.5.2.4 Sequential Read
        5. 8.5.2.5 DSP Memory Book, Page and BQ update
        6. 8.5.2.6 Checksum
          1. 8.5.2.6.1 Cyclic Redundancy Check (CRC) Checksum
          2. 8.5.2.6.2 Exclusive or (XOR) Checksum
      3. 8.5.3 Control via Software
        1. 8.5.3.1 Startup Procedures
        2. 8.5.3.2 Shutdown Procedures
        3. 8.5.3.3 Protection and Monitoring
          1. 8.5.3.3.1 Overcurrent Limit (Cycle-By-Cycle)
          2. 8.5.3.3.2 Overcurrent Shutdown (OCSD)
          3. 8.5.3.3.3 DC Detect
    6. 8.6 Register Maps
      1. 8.6.1 CONTROL PORT Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 LC Filter Design For Piezo Speaker Driving
        1. 9.1.1.1 LC Filter Recommendation
      2. 9.1.2 Bootstrap Capacitors
      3. 9.1.3 Power Supply Decoupling
      4. 9.1.4 Output EMI Filtering
    2. 9.2 Typical Applications
      1. 9.2.1 2.0 (Stereo BTL) System
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design procedures
        1. 9.2.3.1 Step One: Hardware Integration
        2. 9.2.3.2 Step Two: Hardware Integration
        3. 9.2.3.3 Step Three: Software Integration
      4. 9.2.4 MONO (PBTL) Systems
  10. 10Power Supply Recommendations
    1. 10.1 DVDD Supply
    2. 10.2 PVDD Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines for Audio Amplifiers
      2. 11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 11.1.3 Optimizing Thermal Performance
        1. 11.1.3.1 Device, Copper, and Component Layout
        2. 11.1.3.2 Stencil Pattern
          1. 11.1.3.2.1 PCB footprint and Via Arrangement
          2. 11.1.3.2.2 Solder Stencil
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

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6.6 Timing Requirements

MIN NOM MAX UNIT
Serial Audio Port Timing – Slave Mode
fSCLK SCLK frequency 1.024 MHz
tSCLK SCLK period 40 ns
tSCLKL SCLK pulse width, low 16 ns
tSCLKH SCLK pulse width, high 16 ns
tSL SCLK rising to LRCK/FS edge 8 ns
tLS LRCK/FS Edge to SCLK rising edge 8 ns
tSU Data setup time, before SCLK rising edge 8 ns
tDH Data hold time, after SCLK rising edge 8 ns
tDFS Data delay time from SCLK falling edge 15 ns
I2C Bus Timing – Standard ns
fSCL SCL clock frequency 100 kHz
tBUF Bus free time between a STOP and START condition 4.7 µs
tLOW Low period of the SCL clock 4.7 µs
tHI High period of the SCL clock 4 µs
tRS-SU Setup time for (repeated) START condition 4.7 µs
tS-HD Hold time for (repeated) START condition 4 µs
tD-SU Data setup time 250 ns
tD-HD Data hold time 0 3450 ns
tSCL-R Rise time of SCL signal 20 + 0.1CB 1000 ns
tSCL-R1 Rise time of SCL signal after a repeated START condition and after an acknowledge bit 20 + 0.1CB 1000 ns
tSCL-F Fall time of SCL signal 20 + 0.1CB 1000 ns
tSDA-R Rise time of SDA signal 20 + 0.1CB 1000 ns
tSDA-F Fall time of SDA signal 20 + 0.1CB 1000 ns
tP-SU Setup time for STOP condition 4 µs
Cb Capacitive load for each bus line 400 pf
I2C Bus Timing – Fast
fSCL SCL clock frequency 400 kHz
tBUF Bus free time between a STOP and START condition 1.3 µs
tLOW Low period of the SCL clock 1.3 µs
tHI High period of the SCL clock 600 ns
tRS-SU Setup time for (repeated)START condition 600 ns
tRS-HD Hold time for (repeated)START condition 600 ns
tD-SU Data setup time 100 ns
tD-HD Data hold time 0 900 ns
tSCL-R Rise time of SCL signal 20 + 0.1CB 300 ns
tSCL-R1 Rise time of SCL signal after a repeated START condition and after an acknowledge bit 20 + 0.1CB 300 ns
tSCL-F Fall time of SCL signal 20 + 0.1CB 300 ns
tSDA-R Rise time of SDA signal 20 + 0.1CB 300 ns
tSDA-F Fall time of SDA signal 20 + 0.1CB 300 ns
tP-SU Setup time for STOP condition 600 ns
tSP Pulse width of spike suppressed 50 ns
Cb Capacitive load for each bus line 400 pf