ZHCSMH3B
February 2022 – December 2023
DLP2021-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
说明(续)
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
Storage Conditions
6.3
ESD Ratings
6.4
Recommended Operating Conditions
12
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Requirements
16
6.8
System Mounting Interface Loads
18
6.9
Micromirror Array Physical Characteristics
20
21
6.10
Micromirror Array Optical Characteristics
6.11
Window Characteristics
6.12
Chipset Component Usage Specification
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Micromirror Array
7.3.2
Double Data Rate (DDR) Interface
7.3.3
Micromirror Switching Control
7.3.4
DMD Voltage Supplies
7.3.5
Logic Reset
7.3.6
Temperature Sensing Diode
7.3.6.1
Temperature Sense Diode Theory
7.4
System Optical Considerations
7.4.1
Numerical Aperture and Stray Light Control
7.4.2
Pupil Match
7.4.3
Illumination Overfill and Alignment
7.5
DMD Image Performance Specification
7.6
Micromirror Array Temperature Calculation
7.7
Micromirror Landed-On/Landed-Off Duty Cycle
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.3
Application Mission Profile Consideration
9
Power Supply Recommendations
9.1
Power Supply Sequencing Requirements
9.1.1
Power Up and Power Down
10
Layout
10.1
Layout Guidelines
10.2
Temperature Diode Pins
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.1.2
Device Markings
11.2
Documentation Support
11.2.1
Related Documentation
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
Device Handling
11.8
术语表
12
Revision History
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
FQU|64
MCLG044B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsmh3b_oa
zhcsmh3b_pm
2
应用
动态地面投影
车辆内外视频投影