ZHCSGW6B October   2017  – October 2021 CSD25501F3

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 接收文档更新通知
    2. 6.2 支持资源
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 术语表
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YJN|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC CHARACTERISTICS
BVDSSDrain-to-source voltageVGS = 0 V, IDS = –250 μA–20V
IDSSDrain-to-source leakage currentVGS = 0 V, VDS = –16 V–50nA
IGSSGate-to-source leakage currentVDS = 0 V, VGS = –6 V–50nA
VDS = 0 V, VGS = –16 V–1mA
VGS(th)Gate-to-source threshold voltageVDS = VGS, IDS = –250 μA–0.45–0.75–1.05V
RDS(on)Drain-to-source on-resistanceVGS = –1.8 V, IDS = –0.1 A120260mΩ
VGS = –2.5 V, IDS = –0.4 A86125
VGS = –4.5 V, IDS = –0.4 A6476
gfsTransconductanceVDS = –2 V, IDS = –0.4 A3.4S
DYNAMIC CHARACTERISTICS
CissInput capacitanceVGS = 0 V, VDS = –10 V,
ƒ = 100 kHz
295385pF
CossOutput capacitance7091pF
CrssReverse transfer capacitance4.15.3pF
RGSeries gate resistance33
RCSeries clamp resistance10,000
QgGate charge total (–4.5 V)VDS = –10 V, IDS = –0.4 A1.021.33nC
QgdGate charge gate-to-drain0.09nC
QgsGate charge gate-to-source0.45nC
Qg(th)Gate charge at Vth0.36nC
QossOutput chargeVDS = –10 V, VGS = 0 V1.8nC
td(on)Turnon delay timeVDS = –10 V, VGS = –4.5 V,
IDS = –0.4 A, RG = 0 Ω
474ns
trRise time428ns
td(off)Turnoff delay time1154ns
tfFall time945ns
DIODE CHARACTERISTICS
VSDDiode forward voltageISD = –0.4 A, VGS = 0 V–0.73–0.95V
QrrReverse recovery chargeVDS = –10 V, IF = –0.4 A, di/dt = 200 A/μs3.0nC
trrReverse recovery time7.4ns