ZHCSFX7B
November 2016 – November 2022
CSD18510KTT
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Specifications
5.1
Electrical Characteristics
5.2
Thermal Information
5.3
Typical MOSFET Characteristics
6
器件和文档支持
6.1
接收文档更新通知
6.2
支持资源
6.3
Trademarks
6.4
Electrostatic Discharge Caution
6.5
术语表
7
Mechanical, Packaging, and Orderable Information
7.1
KTT Package Dimensions
7.2
Recommended PCB Pattern
7.3
Recommended Stencil Opening (0.125 mm Stencil Thickness)
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
KTT|2
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsfx7b_oa
7.3
Recommended Stencil Opening (0.125 mm Stencil Thickness)
Notes:
This package is designed to be soldered to a thermal pad on the board. See
PowerPAD™
Thermally Enhanced Package
(SLMA002) and
PowerPAD
TM
Made Easy
(SLMA004) for more information.
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
Board assembly site may have different recommendations for stencil design.