ZHCS757A
February 2012 – April 2016
CDCM9102
PRODUCTION DATA.
1
特性
2
应用范围
3
说明
4
修订历史记录
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
Typical Characteristics
8
Parameter Measurement Information
8.1
Test Configurations
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagrams
9.3
Feature Description
9.4
Device Functional Modes
9.4.1
Crystal Input (XIN) Interface
9.4.2
Interfacing between LVPECL and HCSL (PCI Express)
9.5
Programming
9.5.1
Device Configuration
10
Application and Implementation
10.1
Application Information
10.1.1
Start-Up Time Estimation
10.1.2
Output Termination
10.1.3
LVPECL Termination
10.1.4
LVDS Termination
10.1.5
LVCMOS Termination
10.1.6
PCI Express Applications
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Device Selection
10.2.2.1.1
Calculation Using LCM
10.2.2.2
Device Configuration
10.2.3
Application Curve
11
Power Supply Recommendations
11.1
Thermal Management
11.2
Power Supply Filtering
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
器件和文档支持
13.1
社区资源
13.2
商标
13.3
静电放电警告
13.4
Glossary
14
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RHB|32
MPQF130D
散热焊盘机械数据 (封装 | 引脚)
RHB|32
QFND029X
订购信息
zhcs757a_oa
zhcs757a_pm
8 Parameter Measurement Information
8.1 Test Configurations
Figure 2. LVCMOS Output Test Load
Figure 3. LVCMOS AC Configuration for Device Test
Figure 4. LVPECL DC Configuration for Device Test
Figure 5. LVPECL AC Configuration for Device Test
Figure 6. LVDS DC Configuration for Device Test
Figure 7. LVDS AC Configuration for Device Test