ZHCS757A February   2012  – April 2016 CDCM9102

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Test Configurations
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Crystal Input (XIN) Interface
      2. 9.4.2 Interfacing between LVPECL and HCSL (PCI Express)
    5. 9.5 Programming
      1. 9.5.1 Device Configuration
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Start-Up Time Estimation
      2. 10.1.2 Output Termination
      3. 10.1.3 LVPECL Termination
      4. 10.1.4 LVDS Termination
      5. 10.1.5 LVCMOS Termination
      6. 10.1.6 PCI Express Applications
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Device Selection
          1. 10.2.2.1.1 Calculation Using LCM
        2. 10.2.2.2 Device Configuration
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Management
    2. 11.2 Power Supply Filtering
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 社区资源
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from * Revision (February 2012) to A Revision

  • 已添加 ESD 额定值表,特性 描述部分,器件功能模式应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分Go
  • Added 文本至说明“该器件最高支持 PCIE 3 代,”Go
  • Changed part number to 1134 25M0000000Go
  • Changed part number to FP2500002Go
  • Added text and Figure 16 to PCI Express ApplicationsGo