ZHCSPR7E November   1998  – October 2022 CD54HC374 , CD54HC574 , CD54HCT374 , CD54HCT574 , CD74HC374 , CD74HC574 , CD74HCT374 , CD74HCT574

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Prerequisite for Switching Characteristics
    6. 5.6 Switching Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • N|20
  • PW|20
  • DW|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 说明

’HC374、’HCT374、’HC574 和 ’HCT574 是八路 D 型触发器，具有三态输出，能够驱动 15 个 LSTTL 负载。八个边沿触发式触发器在时钟 (CP) 从低电平向高电平转换时将数据输入其寄存器。输出使能端 (OE) 控制三态输出，不受寄存器操作的影响。当 OE 为高电平时，输出处于高阻态。374 和 574 功能相同，只是引脚排列方式不同。

器件信息
器件型号 封装(1) 封装尺寸（标称值）
CD54HC374F3A CDIP (20) 26.92mm × 6.92mm
CD54HC574F CDIP (20) 26.92mm × 6.92mm
CD54HCT374F3A CDIP (20) 26.92mm × 6.92mm
CD54HCT574F CDIP (20) 26.92mm × 6.92mm
CD74HC374M SOIC (20) 12.80mm × 7.50mm
CD74HC574M SOIC (20) 12.80mm × 7.50mm
CD74HCT374M SOIC (20) 12.80mm × 7.50mm
CD74HCT574M SOIC (20) 12.80mm × 7.50mm
CD74HC374E PDIP (20) 25.40mm × 6.35mm
CD74HC574E PDIP (20) 25.40mm × 6.35mm
CD74HCT374E PDIP (20) 25.40mm × 6.35mm
CD74HCT574E PDIP (20) 25.40mm × 6.35mm
CD74HCT574PWR TSSOP (20) 6.50mm × 4.40mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
GUID-20210902-SS0I-TWZG-7DLK-PFRHZPNL2RFN-low.png功能图