ZHCSPY5A January   2004  – February 2022 CD74HC595

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
    1.     5
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6.     12
    7. 5.6 Switching Characteristics
    8. 5.7 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DB|16
  • NS|16
  • DW|16
  • N|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 说明

CD74HC595 是一款具有输出寄存器和三态输出的 8 位串行输入并行输出移位寄存器。

器件信息
零件编号 封装(1) 封装尺寸（标称值）
CD74HC595E PDIP (16) 19.31mm × 6.35mm
CD74HC595DW SOIC-DW (16) 10.30mm x 7.50mm
CD74HC595M SOIC-D (16) 9.90mm × 3.90mm
CD74HC595NS SO (16) 10.20mm × 5.30mm
CD74HC595SM SSOP (16) 6.20mm x 5.30mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
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