ZHCSJU5B February   2019  – May 2021 CC3135

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
      1.      12
    4. 7.4 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary: 2.4 GHz RF Band
    6. 8.6  Current Consumption Summary: 5 GHz RF Band
    7. 8.7  TX Power Control for 2.4 GHz Band
    8. 8.8  TX Power Control for 5 GHz
    9. 8.9  Brownout and Blackout Conditions
      1.      24
    10. 8.10 Electrical Characteristics for DIO Pins
      1.      26
      2.      27
    11. 8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 8.12 WLAN Receiver Characteristics
      1.      30
      2.      31
    13. 8.13 WLAN Transmitter Characteristics
      1.      33
      2.      34
    14. 8.14 WLAN Transmitter Out-of-Band Emissions
      1.      36
      2.      37
    15. 8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 8.16 Thermal Resistance Characteristics for RGK Package
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Power Supply Sequencing
      2. 8.17.2 Device Reset
      3. 8.17.3 Reset Timing
        1. 8.17.3.1 nRESET (32-kHz Crystal)
        2.       45
        3. 8.17.3.2 nRESET (External 32-kHz Crystal)
          1.        47
      4. 8.17.4 Wakeup From HIBERNATE Mode
        1.       49
      5. 8.17.5 Clock Specifications
        1. 8.17.5.1 Slow Clock Using Internal Oscillator
          1.        52
        2. 8.17.5.2 Slow Clock Using an External Clock
          1.        54
        3. 8.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.        56
        4. 8.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.        58
      6. 8.17.6 Interfaces
        1. 8.17.6.1 Host SPI Interface Timing
          1.        61
        2. 8.17.6.2 Flash SPI Interface Timing
          1.        63
        3. 8.17.6.3 DIO Interface Timing
          1. 8.17.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1.         66
          2. 8.17.6.3.2 DIO Input Transition Time Parameters
            1.         68
    18. 8.18 External Interfaces
      1. 8.18.1 SPI Flash Interface
      2. 8.18.2 SPI Host Interface
      3. 8.18.3 Host UART Interface
        1. 8.18.3.1 5-Wire UART Topology
        2. 8.18.3.2 4-Wire UART Topology
        3. 8.18.3.3 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Device Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Security
      4. 9.2.4 Host Interface and Driver
      5. 9.2.5 System
    3. 9.3 FIPS 140-2 Level 1 Certification
    4. 9.4 Power-Management Subsystem
      1. 9.4.1 VBAT Wide-Voltage Connection
    5. 9.5 Low-Power Operating Modes
      1. 9.5.1 Low-Power Deep Sleep
      2. 9.5.2 Hibernate
      3. 9.5.3 Shutdown
    6. 9.6 Memory
      1. 9.6.1 External Memory Requirements
    7. 9.7 Restoring Factory Default Configuration
    8. 9.8 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1  第三方产品免责声明
    2. 11.2  Tools and Software
    3. 11.3  Firmware Updates
    4. 11.4  Device Nomenclature
    5. 11.5  Documentation Support
    6. 11.6  支持资源
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
    2. 12.2 Package Option Addendum
      1. 12.2.1 Packaging Information
      2. 12.2.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.2 Tools and Software

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed in this section.

For the most up-to-date list of development tools and software, see the CC3135 Tools & Software product page. Users can also click the "Alert Me" button on the top right corner of the CC3135 Tools & Software page to stay informed about updates related to the CC3135 device.

Development Tools

    SimpleLink™ Wi-Fi® Starter Pro

    The supported devices are: CC3100, CC3200, CC3120R, CC3220x, CC3135, and CC3235x.

    The SimpleLink™ Wi-Fi® Starter Pro mobile App is a new mobile application for SimpleLink™ provisioning. The app goes along with the embedded provisioning library and example that runs on the device side (see SimpleLink™ Wi-Fi® SDK plugin and TI SimpleLink™ CC32XX Software Development Kit (SDK)). The new provisioning release is a TI recommendation for Wi-Fi provisioning using SimpleLink™ Wi-Fi® products. The provisioning release implements advanced AP mode and SmartConfig™ technology provisioning with feedback and fallback options to ensure successful process has been accomplished. Customers can use both embedded library and the mobile library for integration to their end products.
    SimpleLink™ Wi-Fi® SDK plugin The CC3135 device is supported.

    The CC3135 SDK contains drivers, many sample applications for Wi-Fi® features and internet, and documentation needed to use the CC3135 Internet-on-a chip™ solution. This SDK can be used with TI’s MSP432P401R LaunchPad™, or SimpleLink™ Studio, a PC tool that allows MCU development with the CC3135 device. You can also use the SDK as example code for any platform. All sample applications in the SDK are supported on TI’s MSP432P401R ultra-low power MCUs with Code Composer Studio™ IDE and TI RTOS. In addition, many of the applications support IAR.
    SimpleLink™ Studio for CC31xx The CC31xx device is supported.

    SimpleLink™ Studio for CC31xx is a Windows®-based software tool used to aid in the development of embedded networking applications and software for microcontrollers. Using SimpleLink™ Studio for CC31xx, embedded software developers can develop and test applications using any desktop IDE, such as Visual Studio or Eclipse, and connect their applications to the cloud using the CC31xx BoosterPack™ Plug-in Module. The application can then be easily ported to any microcontroller. With the SimpleLink™ Wi-Fi® CC31xx solution, customers now have the flexibility to add Wi-Fi® to any microcontroller (MCU). This Internet-on-a-chip solution contains all you need to easily create IoT solutions: security, quick connection, cloud support, and more. For more information on CC31xx devices, visit SimpleLink™ Wi-Fi® solutions.
    SimpleLink™ Wi-Fi® Radio Testing Tool

    The supported devices are: CC3100, CC3200, CC3120R, CC3220, CC3135 and CC3235x.

    The SimpleLink™ Wi-Fi® Radio Testing Tool is a Windows-based software tool for RF evaluation and testing of SimpleLink™ Wi-Fi® CC3x20 and CC3x35 designs during development and certification. The tool enables low-level radio testing capabilities by manually setting the radio into transmit or receive modes. Using the tool requires familiarity and knowledge of radio circuit theory and radio test methods.

    Created for the internet-of-things (IoT), the SimpleLink™ Wi-Fi® CC31xx and CC32xx family of devices include on-chip Wi-Fi®, Internet, and robust security protocols with no prior Wi-Fi® experience needed for faster development. For more information on these devices, visit SimpleLink™ Wi-Fi® family, Internet-on-a chip™ solutions.

TI Designs and Reference Designs

The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs include schematic or block diagrams, BOMs, and design files to speed your time to market.