ZHCSM59B
November 2014 – September 2020
CC3100MOD
PRODUCTION DATA
1
特性
2
应用
3
说明
4
功能方框图
5
功能方框图
6
Revision History
7
Terminal Configuration and Functions
7.1
CC3100MOD Pin Diagram
7.2
Pin Attributes
10
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Power-On Hours (POH)
8.4
Recommended Operating Conditions
8.5
Power Consumption Summary
8.6
TX Power and IBAT versus TX Power Level Settings
8.7
Brownout and Blackout Conditions
8.8
Electrical Characteristics (3.3 V, 25°C)
8.9
WLAN RF Characteristics
8.9.1
WLAN Receiver Characteristics
8.9.2
WLAN Transmitter Characteristics
8.10
Reset Requirement
8.11
Thermal Resistance Characteristics for MOB Package
8.12
Timing and Switching Characteristics
8.12.1
Wake-Up Sequence
8.12.2
Wake Up From Hibernate
8.12.2.1
nHIB Timing Requirements (1)
8.12.3
Interfaces
8.12.3.1
Host SPI Interface Timing
8.12.3.2
SPI Host Interface
8.13
Host UART
8.13.1
5-Wire UART Topology
8.13.2
4-Wire UART Topology
8.13.3
3-Wire UART Topology
9
Detailed Description
9.1
Overview
9.2
Module Features
9.2.1
WLAN
9.2.2
Network Stack
9.2.3
Host Interface and Driver
9.2.4
System
9.3
Functional Block Diagram
9.4
Wi-Fi Network Processor Subsystem
9.5
Power-Management Subsystem
9.5.1
VBAT Wide-Voltage Connection
9.6
Low-Power Operating Modes
9.6.1
Low-Power Deep Sleep
9.6.2
Hibernate
10
Applications, Implementation, and Layout
10.1
Reference Schematics
10.2
Design Requirements
10.3
Layout Recommendations
10.3.1
RF Section (Placement and Routing)
10.3.2
Antenna Placement and Routing
10.3.3
Transmission Line Considerations
11
Environmental Requirements and Specifications
11.1
Temperature
11.1.1
PCB Bending
11.2
Handling Environment
11.2.1
Terminals
11.2.2
Falling
11.3
Storage Condition
11.3.1
Moisture Barrier Bag Before Opened
11.3.2
Moisture Barrier Bag Open
11.4
Baking Conditions
11.5
Soldering and Reflow Condition
12
Device and Documentation Support
12.1
Device Support
12.1.1
Development Support
12.1.1.1
Firmware Updates
12.1.2
Device Nomenclature
12.2
Documentation Support
12.3
Trademarks
12.4
静电放电警告
12.5
术语表
13
Mechanical, Packaging, and Orderable Information
13.1
Mechanical Drawing
13.2
Package Option
13.2.1
Packaging Information
13.2.2
Tape and Reel Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
MOB|63
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsm59b_oa
12.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。