ZHCSU78 December   2023 CC2340R5-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram – RHB Package (Top View)
    2. 6.2 Signal Descriptions – RHB Package
    3. 6.3 Connections for Unused Pins and Modules – RHB Package
    4. 6.4 RHB Peripheral Pin Mapping
    5. 6.5 RHB Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Thermal Shutdown
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy - Receive (RX)
    16. 7.16 Bluetooth Low Energy - Transmit (TX)
    17. 7.17 2.4 GHz RX/TX CW
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.18.3.2 48 MHz RC Oscillator (HFOSC)
        3. 7.18.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 7.18.3.4 32 kHz RC Oscillator (LFOSC)
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 UART
        1. 7.19.1.1 UART Characteristics
      2. 7.19.2 SPI
        1. 7.19.2.1 SPI Characteristics
        2. 7.19.2.2 SPI Controller Mode
        3. 7.19.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.19.2.4 SPI Peripheral Mode
        5. 7.19.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.19.3 I2C
        1. 7.19.3.1 I2C
        2. 7.19.3.2 I2C Timing Diagram
      4. 7.19.4 GPIO
        1. 7.19.4.1 GPIO DC Characteristics
      5. 7.19.5 ADC
        1. 7.19.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.19.6 Comparators
        1. 7.19.6.1 Ultra-low power comparator
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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6.2 Signal Descriptions – RHB Package

Table 6-1 Signal Descriptions – RHB Package
PIN I/O TYPE DESCRIPTION
NAME NO.
EGP — — GND Ground – exposed ground pad(1)
VDDR 1 — Power Internal 1.5-V supply, must be powered from the internal DC/DC converter or the internal LDO(2)(3)(4)
DIO8 2 I/O Digital GPIO
DIO11 3 I/O Digital GPIO
DIO12 4 I/O Digital GPIO, high-drive capability
DIO13 5 I/O Digital GPIO
VDDS 6 — Power 1.71-V to 3.8-V DIO supply(5)
DIO14 7 I/O Digital GPIO
DIO16_SWDIO 8 I/O Digital GPIO, SWD interface: mode select or SWDIO, high-drive capability
DIO17_SWDCK 9 I/O Digital GPIO, SWD interface: clock, high-drive capability
DIO18 10 I/O Digital GPIO, high-drive capability
DIO19 11 I/O Digital GPIO, high-drive capability
DIO20_A11 12 I/O Digital or Analog GPIO, analog capability
DIO21_A10 13 I/O Digital or Analog GPIO, analog capability
VDDS 14 — Power 1.71-V to 3.8-V DIO supply(5)
DIO22_A9 15 I/O Digital or Analog GPIO, analog capability
DIO23_A8 16 I/O Digital or Analog GPIO, analog capability
DIO24_A7 17 I/O Digital or Analog GPIO, analog capability, high-drive capability
DIO1_A4 18 I/O Digital or Analog GPIO, analog capability
RSTN 19 I Digital Reset, active low. No internal pullup resistor
DIO3_X32P 20 I/O Digital or Analog GPIO, 32-kHz crystal oscillator pin 1, Optional TCXO input
DIO4_X32N 21 I/O Digital or Analog GPIO, 32-kHz crystal oscillator pin 2
VDDD 22 — Power For decoupling of internal 1.28-V regulated core-supply. Connect an external 1 μF decoupling capacitor.(2)
DIO5_A2 23 I/O Digital or Analog GPIO, analog capability
DCDC 24 — Power Switching node of internal DC/DC converter(5)
VDDS 25 — Power 1.71-V to 3.8-V analog supply(5)
DIO6_A1 26 I/O Digital or Analog GPIO, analog capability
VDDR 27 — Power Internal 1.5-V supply, must be powered from the internal DC/DC converter or the internal LDO. Connect an external 10 μF decoupling capacitor.(2)(3)(4)
X48P 28 — Analog 48-MHz crystal oscillator pin 1
X48N 29 — Analog 48-MHz crystal oscillator pin 2
VDDS 30 — Power 1.71-V to 3.8-V analog supply(5)
ANT 31 I/O RF 2.4 GHz TX, RX
RFGND 32 — RFGND RF Ground
(1) EPG is the only non-RF ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is imperative for proper device operation.
(2) Do not supply external circuitry from this pin.
(3) VDDR pins 1 and 27 must be tied together on the PCB.
(4) Output from internal DC/DC and LDO is trimmed to 1.5 V.
(5) For more details, see the technical reference manual listed in Section 10.3.