ZHCSEZ5 May   2016

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Power On
      3. 7.3.3 Power-Path Management
        1. 7.3.3.1 Input Source Connected - Adapter or USB
          1. 7.3.3.1.1 Input Voltage Dynamic Power Management, (VIN_DPM)
          2. 7.3.3.1.2 Dynamic Power Path Management (DPPM)
          3. 7.3.3.1.3 Battery Supplement Mode
        2. 7.3.3.2 Input Source not Connected
      4. 7.3.4 Thermal Regulation and Thermal Shutdown
      5. 7.3.5 Battery Pack Temperature Monitoring
        1. 7.3.5.1 Modifying and Extending the Allowable Temperature Range for Charging
    4. 7.4 Device Functional Modes
      1. 7.4.1 Battery Charging
        1. 7.4.1.1 Charge Current Translator
        2. 7.4.1.2 Battery Detection and Recharge
        3. 7.4.1.3 Adjustable Termination Threshold (ITERM Input)
        4. 7.4.1.4 Dynamic Charge Timers (TMR Input)
        5. 7.4.1.5 Status Indicators (PGOOD, CHG)
          1. 7.4.1.5.1 Timer Fault
      2. 7.4.2 Explanation of Deglitch Times and Comparator Hysteresis
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Calculations
          1. 8.2.2.1.1 Program The Fast-Charge Current (ISET):
          2. 8.2.2.1.2 Program The Input Current Limit (ILIM)
          3. 8.2.2.1.3 Program The Termination Current Threshold (ITERM, bq24232HA)
          4. 8.2.2.1.4 Program 7.5-hour Fast-Charge Safety Timer (TMR)
        2. 8.2.2.2 TS Function
        3. 8.2.2.3 CHG and PGOOD
        4. 8.2.2.4 Selecting IN, OUT, and BAT Pin Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Requirements for OUT Output
    2. 9.2 USB Sources and Standard AC Adapters
    3. 9.3 Half-Wave Adapters
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档　
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 文档支持

11.2.1 相关文档　

应用报告《QFN/SON PCB 连接》，SLUA271

11.3 商标

Bluetooth is a trademark of Bluetooth SIG, Inc..

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.