ZHCSI02I May   1995  – April 2024 AM26LV31

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Active high and active low
      2. 7.3.2 Operates from a 3.3-V Supply with up to 5-V Logic
      3. 7.3.3 High Speed Transmission
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NS|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision H (April 2018) to Revision I (April 2024)

  • 将“器件信息”更改为封装信息 表Go
  • Changed the Thermal Information table valuesGo
  • Changed Figure 5-1 Go
  • Changed the Note B in Figure 6-2 Go

Changes from Revision G (May 2005) to Revision H (April 2018)

  • 添加了器件信息 表、ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Changed the tPLH and tPHL MAX value From: 12 ns To: 20 ns in the Switching Characteristics Go
  • Changed the tsk(p) and tsk(o) MAX value From: 1.5 ns To: 3 ns in the Switching Characteristics Go