ZHCSSQ9G october 1980 – august 2023 AM26LS32AC , AM26LS32AM , AM26LS33AM
PRODUCTION DATA
THERMAL METRIC(1) | AM26LS3xAC, AM26LS32AI | AM26LS32AC | UNIT | |||||||
---|---|---|---|---|---|---|---|---|---|---|
D (SOIC) | DR (SOIC-Reel) | N (PDIP) | NR (PDIP-Reel) | NS (SO) | NSR (SO-Reel) | PW (TSSOP) | PWR (TSSOP-Reel) | |||
16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 75.7 | 84.6 | 45.3 | 60.6 | 75.8 | 88.5 | 102.7 | 107.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 35 | 43.5 | 32.7 | 48.1 | 32.9 | 46.2 | 37.8 | 38.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 33.3 | 43.2 | 25.3 | 40.6 | 36.6 | 50.7 | 47.7 | 53.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 6.6 | 10.4 | 17.8 | 27.5 | 6 | 13.5 | 3 | 3.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 33 | 42.8 | 25.1 | 40.3 | 36.3 | 50.3 | 47.1 | 53.1 | °C/W |