ZHCSSQ9G october   1980  – august 2023 AM26LS32AC , AM26LS32AM , AM26LS33AM

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1.     17
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1.      23
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) AM26LS3xAC, AM26LS32AI AM26LS32AC UNIT
D (SOIC) DR (SOIC-Reel) N (PDIP) NR (PDIP-Reel) NS (SO) NSR (SO-Reel) PW (TSSOP) PWR (TSSOP-Reel)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 75.7 84.6 45.3 60.6 75.8 88.5 102.7 107.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35 43.5 32.7 48.1 32.9 46.2 37.8 38.4 °C/W
RθJB Junction-to-board thermal resistance 33.3 43.2 25.3 40.6 36.6 50.7 47.7 53.7 °C/W
ψJT Junction-to-top characterization parameter 6.6 10.4 17.8 27.5 6 13.5 3 3.2 °C/W
ψJB Junction-to-board characterization parameter 33 42.8 25.1 40.3 36.3 50.3 47.1 53.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.