ZHCSCQ1B October   2013  – August 2014 ADS7253 , ADS7853 , ADS8353

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configurations and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS8353
    6. 7.6  Electrical Characteristics: ADS7853
    7. 7.7  Electrical Characteristics: ADS7253
    8. 7.8  Electrical Characteristics: All Devices
    9. 7.9  Timing Requirements: Interface Mode
    10. 7.10 Timing Characteristics: Serial Interface
    11. 7.11 Typical Characteristics: ADS8353
    12. 7.12 Typical Characteristics: ADS7853
    13. 7.13 Typical Characteristics: ADS7253
    14. 7.14 Typical Characteristics: Common to ADS8353, ADS7853, and ADS7253
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Reference
      2. 8.3.2 Analog Inputs
        1. 8.3.2.1 Analog Input: Full-Scale Range Selection
        2. 8.3.2.2 Analog Input: Single-Ended and Pseudo-Differential Configurations
      3. 8.3.3 Transfer Function
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps and Serial Interface
      1. 8.5.1 Serial Interface
      2. 8.5.2 Write to User Programmable Registers
        1. 8.5.2.1 Configuration Register (CFR)
        2. 8.5.2.2 REFDAC Registers (REFDAC_A and REFDAC_B)
      3. 8.5.3 Data Read Operation
        1. 8.5.3.1 Reading User-Programmable Registers
        2. 8.5.3.2 Conversion Data Read
          1. 8.5.3.2.1 32-CLK, Dual-SDO Mode (CFR.B11 = 0, CFR.B10 = 0, Default)
          2. 8.5.3.2.2 32-CLK, Single-SDO Mode (CFR.B11 = 0, CFR.B10 = 1)
          3. 8.5.3.2.3 16-CLK, Dual-SDO Mode (CFR.B11 = 1, CFR.B10 = 0)
          4. 8.5.3.2.4 16-CLK, Single-SDO Mode (CFR.B11 = 1, CFR.B10 = 1)
      4. 8.5.4 Low-Power Modes
        1. 8.5.4.1 STANDBY Mode
        2. 8.5.4.2 Software Power-Down (SPD) Mode
      5. 8.5.5 Frame Abort, Reconversion, or Short-Cycling
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Amplifier Selection
      2. 9.1.2 Antialiasing Filter
    2. 9.2 Typical Applications
      1. 9.2.1 DAQ Circuit to Achieve Maximum SINAD for a 10-kHz Input Signal at Full Throughput
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 DAQ Circuit to Achieve Maximum SINAD for a 100-kHz Input Signal at Full Throughput
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 相关文档 
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 相关链接

以下表格列出了快速访问链接。 范围包括技术文档、支持与社区资源、工具和软件,并且可以快速访问样片或购买链接。

12.2 相关文档 

  • TIPD117 验证设计参考指南:针对电机控制应用中光学编码器的 12 位 1MSPS 单电源双通道数据采集系统参考设计,SLAU517
  • REF5050 数据表,SBOS410
  • OPA2350 数据表,SBOS099
  • OPA836、OPA2836 数据表,SLOS712
  • THS4032 数据表,SLOS224

12.3 Trademarks

TINA is a trademark of Texas Instruments Inc..

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。